## First high-performance ARM on COM-HPC Mini

- Up to 12 Qualcomm® Oryon™ CPU cores  
- Qualcomm® Hexagon NPU with 45 TOPS  
- High performance Qualcomm® Adreno GPU  
- PCI Express Gen 4 | USB 4  
- Industrial Temperature Range -40°C to +85°C  

www.congatec.com  

---

## Form Factor

- COM-HPC® Mini  

## CPUs

- Qualcomm® Dragonwing™ IQ-X Series modules featuring Oryon™ CPU with up to 12 cores  

## DRAM

- Soldered down LPDDR5x memory from 16GB up to 64GB capacity | up to 8400 MT/s  

## Mass Storage

- UFS 4.0 SSD up to 1 TB capacity  

## Graphics

- Qualcomm® Adreno GPU | Qualcomm® Spectra ISP  

## AI Acceleration

- Qualcomm® Hexagon NPU with up to 45 TOPS  

## Display

- Up to 2x DDI (2x shared with USB4) | eDP v1.4 | up to 4k (UHD) resolution  

## Ethernet

- 2x 2.5 GbE via Qualcomm® QCA8081 Ethernet PHY transceiver | IEEE 1588v2 support | MACsec  

## I/O Interfaces

- Up to 16x PCIe lanes (12x PCIe Gen4 + 4x PCIe Gen3) | Up to 2x USB 4 | 2x USB 3.1 Gen2 + 2x USB 3.0 |  
  6x USB2.0 | 2x 4-lane CSI | 2x UART | 2x UART | 12x GPIOs | QSPI | GP SPI | 4x I2C | CAN  

## Audio

- I2S | SoundWire (optional)  

## Embedded Controller

- Multi-stage Watchdog | Manufacturing and Board Information | Board Statistics | Power Loss Control | Hardware Health Monitoring | System FAN control  

## Embedded BIOS Feature

- AMI Aptio® V UEFI firmware for ARM | 64 Mbyte serial SPI with congatec Embedded BIOS feature | OEM Logo | OEM CMOS default settings | LCD Control | Display Auto Detection | Backlight Control | Flash Update  

## Security

- Trusted Platform Module (TPM 2.0)  

## Power Management

- Embedded Controller | ACPI with battery support  

## Operating Systems

- Ubuntu Pro Linux | Yocto | Microsoft® Windows 11 IoT Enterprise LTSC  

## Temperature

- Operating: -40°C to 85°C  
- Storage: -40°C to 85°C  

## Humidity

- Operating 10% to 85% r. H. non cond.  
- Storage 5% to 85% r. H. non cond.  

## Size

- 95 x 70 mm  

---

## Qualcomm® Dragonwing™ IQ-X Series

conga-HPC/mIQ-X

---

## conga-HPC/mIQ-X | Block Diagram

- Qualcomm® Dragonwing IQ-X Series  
- System-in-Package  
- COM HPC Mini Connector  

- UFS 4.0 (128 GB to 1 TB)  
- TPM 2.0  

- PCIe 4-7 Gen 4  
- Assembly Option  

- 16-64GB LPDDR5x  
- 16-64GB LPDDR5x  
- 16-64GB LPDDR5x  
- 16-64 GB LPDDR5x  

- UFS 4.0  
- DDI / USB 4 (eDP)  
- DDI / USB 4 (eDP)  

- USB 3.1 Gen2  
- USB 3 Hub  
- USB 3.1 Gen 2  

- PCIe 8-15 Gen 4  
- QPS615 Bridge PCIe Gen 3  
- PCIe Gen 3 QPS615 Bridge  

- Ethernet Phy (2.5 GbE)  
- Ethernet Phy (2.5 GbE)  

- PCIe 2-3  
- PCIe 0-1  
- PCIe 4-7  
- PCIe 8-15  

- SPI  
- 4x I2C  
- 2x UART  
- QSPI  

- I2S / SNDW  
- SNDW / DMIC  
- SNDW / DMIC  

- SPI  
- QSPI Boot SPI  
- I2C  

- ACPI Int  
- Sleep Ind  
- Power On  

- Board Controller  

- Temp Sens  
- PWRBTN#, SLPBTN#  
- SUS_S3#,SUS_S4_S5#b  

- Wake, LID, Sys Fan  
- Sys Therm  

- SPI SPI to CAN  

- MIPI-CSI 4-lane (CSI 0)  
- MIPI-CSI 4-lane (CSI 1)  

- 12x GPIO  
- 5x USB 2.0  

- USB 3.1 Gen 2  
- DDI / USB 4  
- eDP / DDI / USB 4  

- USB 3.0  
- USB 3.1 Gen 2  
- USB 3.0  
- USB 2.0  

- CPU Fan  

---

## conga-HPC/mIQ-X | Modules Order Information

| Article | PN | Description |
|---|---|---|
| conga-HPC/mIQ-X7-64G UFS128 | 053100 | COM-HPC Mini module based on Qualcomm® Dragonwing IQ-X7 with 12 Oryon CPU cores up to 3.4GHz | 64GB soldered down LPDDR5x memory | Adreno GPU | Hexagon NPU with 45 TOPS | Adreno DPU | Spectra ISP | 6MB system cache | 128GB onboard UFS | 28-45W TDP | Industrial grade temperature range from -40°C to 85°C. |
| conga-HPC/mIQ-X7-32G UFS128 | 053101 | COM-HPC Mini module based on Qualcomm® Dragonwing IQ-X7 with 12 Oryon CPU cores up to 3.4GHz | 32GB soldered down LPDDR5x memory | Adreno GPU | Hexagon NPU with 45 TOPS | Adreno DPU | Spectra ISP | 6MB system cache | 128GB onboard UFS | 28-45W TDP | Industrial grade temperature range from -40°C to 85°C. |
| conga-HPC/mIQ-X7-16G UFS128 | 053102 | COM-HPC Mini module based on Qualcomm® Dragonwing IQ-X7 with 12 Oryon CPU cores up to 3.4GHz | 16GB soldered down LPDDR5x memory | Adreno GPU | Hexagon NPU with 45 TOPS | Adreno DPU | Spectra ISP | 6MB system cache | 128GB onboard UFS | 28-45W TDP | Industrial grade temperature range from -40°C to 85°C. |
| conga-HPC/mIQ-X5-32G UFS128 | 053103 | COM-HPC Mini module based on Qualcomm® Dragonwing IQ-X5 with 8 Oryon CPU cores up to 3.4GHz | 32GB soldered down LPDDR5x memory | Adreno GPU | Hexagon NPU with 45 TOPS | Adreno DPU | Spectra ISP | 6MB system cache | 128GB onboard UFS | 28-45W TDP | Industrial grade temperature range from -40°C to 85°C. |
| conga-HPC/mIQ-X5-16G UFS128 | 053104 | COM-HPC Mini module based on Qualcomm® Dragonwing IQ-X5 with 8 Oryon CPU cores up to 3.4GHz | 16GB soldered down LPDDR5x memory | Adreno GPU | Hexagon NPU with 45 TOPS | Adreno DPU | Spectra ISP | 6MB system cache | 128GB onboard UFS | 28-45W TDP | Industrial grade temperature range from -40°C to 85°C. |

www.congatec.com  

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## conga-HPC/mIQ-X | Accessories Order Information

| Article | PN | Description |
|---|---|---|
| conga-HPC/mIQ-X-CSA-B | 053150 | Standard active cooling solution for COM-HPC module conga-HPC/mIQ-X with 24.5mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. |
| conga-HPC/mIQ-X-CSA-T | 053151 | Standard active cooling solution for COM-HPC module conga-HPC/mIQ-X with 24.5mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm threaded. |
| conga-HPC/mIQ-X-CSP-B | 053152 | Standard passive cooling solution for COM-HPC module conga-HPC/mIQ-X with 23.7mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| conga-HPC/mIQ-X-CSP-T | 053153 | Standard passive cooling solution for COM-HPC module conga-HPC/mIQ-X with 23.7mm overall heatsink height. All standoffs are M2.5mm threaded. |
| conga-HPC/mIQ-X-HSP-B | 053154 | Standard heatspreader for COM-HPC module conga-HPC/mIQ-X. All standoffs are with 2.7mm bore hole. |
| conga-HPC/mIQ-X-HSP-T | 053155 | Standard heatspreader for COM-HPC module conga-HPC/mIQ-X. All standoffs are M2.5mm threaded. |

www.congatec.com  

All data is for information purposes only. Although all the information contained within this document is carefully checked, no guarantee of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or the property of their respective trademark holders. These trademark holders are not affiliated with congatec GmbH. Product not yet released for Mass Production.  

Revision 0.5 – May 08, 2026  

© 2026 congatec GmbH.  
All rights reserved.