# conga-HPC/cBLS  
## Form factor / COM-HPC Client Size C | Client Connector Pinout

**CPUs**  
Intel® Core™ processor (Series 2) – formerly codenamed: *Bartlett Lake S*

**Processor Socket**  
FCLGA 1700

**Chipset**  
R680E | Q670E

**DRAM**  
4 SO-DIMM sockets for DDR5 memory modules up to 48 GByte each | max. 192 GByte RAM system capacity  
up to 4.000 MT/s | ECC Support on selected product variants

**Graphics**  
Up to Intel® UHD Graphics 770 driven by Xe Architecture | up to 32 EU

**Display**  
3x DDI | eDP

**Ethernet**  
2x 2.5 GbE with TSN support via Intel® i226 Ethernet controller series (TSN only on selected PNs)

**I/O Interfaces**  
1x16 PCIe Gen 5 (PEG port) | 3x4 PCIe Gen 4 | up to 3x4 PCIe Gen 3 | 1x2 PCIe Gen3 | 4x USB 3.2 Gen2x2 (including 4x USB 2.0) + 4x USB2.0 | 2x SATA | 2x UART | 12x GPIO

**Audio**  
High-Definition Audio

**congatec Board controller**  
Multi-Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics  
I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection

**Embedded BIOS Feature**  
AMI Aptio® UEFI firmware | 32 Mbyte serial SPI with congatec Embedded BIOS feature | OEM Logo | OEM CMOS default settings | LCD Control | Display Auto Detection | Backlight Control | Flash Update

**Security**  
Trusted Platform Module (TPM 2.0)

**Power Management**  
ACPI 5.0a with battery support

**Operating Systems**  
Microsoft® Windows 11 | Microsoft® Windows 11 IoT Enterprise | Microsoft® Windows 10 | Microsoft® Windows 10 IoT Enterprise | Linux | Yocto

**Hypervisor**  
RTS Real-Time Hypervisor

**Temperature Range**  
Operation: 0°C to 60°C  
Storage.: -20°C to 80°C

**Humidity**  
Operation: 10% to 85% r. H. non cond.  
Storage. 5% to 85% r. H. non cond.

**Size**  
120 x 160 mm

**Product variants based on**  
Intel® hybrid design and Intel® P-core only

**Up to**  
Intel® UHD Graphics 770 driven by Xe Architecture

**PCI Express**  
PCI Express Gen 4 and 5 | USB 3.2 Gen 2x2

**AI Acceleration based on**  
Intel® Deep Learning Boost (VNNI)

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## conga-HPC/cBLS | Block Diagram

- **COM-HPC Client Type Connectors**
- **SO-DIMM\*** (x2)  
- **Dual Channel DDR5**
- **Intel® PCH-S 600 Series Chipset**
- **Intel® Core™ Series 2**
- **Bartlett Lake S**
- **congatec Board Controller**
- **eSPI**
- **Boot SPI**
- **SM Bus**
- **G SPI**
- **TPM 2.0 SPI Flash**
- **PCIe 36-37**
- **PCIe 40-43** *(Only available on selected product variants)*
- **PCIe 32-35**
- **PCIe 0**
- **PCIe 4-7**
- **PCIe 8-11**
- **PCIe 12-15**
- **PCIe 16-31**
- **UART 0**
- **UART 1**
- **Lid# Sleep#**
- **FAN Contr**
- **DDI 0**
- **DDI 1**
- **DDI 2**
- **eDP**
- **HDA**
- **SATA 0**
- **SATA 1**
- **TPM 2.0**
- **eSPI**
- **I2C 0-1**
- **GPIO 0-11**
- **SATA**
- **TPM 2.0 SPI Flash**

**Note (from diagram):**  
\* The two bottom-side SO-DIMM connectors require implementation of 10 mm COM-HPC® carrier connector height stack option. Ensure that carrier components do not collide with the module's bottom-side SO-DIMM connectors, including during assembly.

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## conga-HPC/cBLS | COM-HPC Client Type Connectors

- **2.5 GbE**
- **2.5 GbE**
- **USB2 0-7**
- **USB3.2 0-3**
- **GPIO 0-11**
- **UART 1**
- **I2C 0-1**
- **PCIe 0**
- **SATA 0**
- **SATA 1**
- **DDI 0**
- **DDI 1**
- **DDI 2**
- **eDP**
- **HDA**
- **PCIe 4-7**
- **PCIe 8-11**
- **PCIe 12-15**
- **PCIe 16-31**
- **Boot SPI**
- **SM Bus**
- **G SPI**
- **SO-DIMM**
- **SO-DIMM \***
- **TPM 2.0 SPI Flash**

**Note (from diagram):**  
Only available on selected product variants.

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## Order Information (1/2)

| Article | PN | Description |
|---|---:|---|
| conga-HPC/cBLS-7-251E | 049820 | COM-HPC Client module based on Intel® Core™ 7-251E LGA 1700 processor with 8 P-cores 2.1GHz up to 5.6GHz Turbo and 16 E-cores 1.6GHz up to 4.4 GHz Turbo \| 36MB Intel® Smart Cache \| Intel® UHD Graphics 770 with 32EUs \| Dual channel DDR5 memory interface \| Chipset R680E \| Intel® code name: Bartlett Lake S |
| conga-HPC/cBLS-5-211E | 049821 | COM-HPC Client module based on Intel® Core™ 5-211E LGA 1700 processor with 6 P-cores 2.7GHz up to 4.9GHz Turbo and 4 E-cores 2.0GHz up to 3.7GHz Turbo \| 20MB Intel® Smart Cache \| Intel® UHD Graphics 770 with 24EUs \| Dual channel DDR5 memory interface \| Chipset R680E \| Intel® code name: Bartlett Lake S |
| conga-HPC/cBLS-3-201E | 049822 | COM-HPC Client module based on Intel® Core™ 3-201E LGA 1700 processor with 4 P-cores 3.6GHz up to 4.8GHz Turbo \| 12MB Intel® Smart Cache \| Intel® UHD Graphics 730 with 24EUs \| Dual channel DDR5 memory interface \| Chipset Q670E \| Intel® code name: Bartlett Lake S |
| conga-HPC/cBLS-9-273PE | 049830 | COM-HPC Client module based on Intel® Core™ 9-273PE LGA 1700 processor with 12 P-cores 2.3GHz up to 5.7GHz Turbo \| 36MB Intel® Smart Cache \| 32EUs \| Dual channel DDR5 memory interface \| Chipset R680E \| Intel® code name: Bartlett Lake S |
| conga-HPC/cBLS-7-253PE | 049831 | COM-HPC Client module based on Intel® Core™ 7-253PE LGA 1700 processor with 10 P-cores 2.5GHz up to 5.5GHz Turbo \| 33MB Intel® Smart Cache \| 32EUs \| Dual channel DDR5 memory interface \| Chipset R680E \| Intel® code name: Bartlett Lake S |
| conga-HPC/cBLS-5-213PE | 049832 | COM-HPC Client module based on Intel® Core™ 5-213PE LGA 1700 processor with 8 P-cores 2.7GHz up to 5.2GHz Turbo \| 24MB Intel® Smart Cache \| 24EUs \| Dual channel DDR5 memory interface \| Chipset R680EE \| Intel® code name: Bartlett Lake S |

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## Order Information (2/2)

| Article | PN | Description |
|---|---:|---|
| conga-HPC/cRLS-CSA-HP-B | 049650 | Standard active cooling solution for COM-HPC module conga-HPC/cRLS with integrated heat pipes, 30mm overall height and two integrated 12V fans. All standoffs are with 2.7mm bore hole. |
| conga-HPC/cRLS-CSA-HP-T | 049651 | Standard active cooling solution for COM-HPC module conga-HPC/cRLS with integrated heat pipes, 30mm height and two integrated 12V fans. All standoffs are M2.5mm threaded. |
| conga-HPC/cRLS-HSP-HP-B | 049652 | Standard heatspreader for COM-HPC module conga-HPC/cRLS with integrated heat pipes, 13mm height. All standoffs are with 2.7mm bore hole. |
| conga-HPC/cRLS-HSP-HP-T | 049653 | Standard heatspreader for COM-HPC module conga-HPC/cRLS with integrated heat pipes, 13mm height. All standoffs are M2.5mm threaded. |
| conga-HPC/cRLS-HPA | 049654 | Standard heatpipe adapter for COM-HPC module conga-HPC/cRLS. |
| conga-HPC/EVAL-Client | 065600 | Evaluation Carrier Board for COM-HPC Client type Modules. |
| conga-HPC/uATX-Client | 065620 | COM-HPC Client µATX Application Carrier Board suitable for congatec COM-HPC modules with Size A,B and C. |
| DDR5-SODIMM-4800 (8GB) | 068901 | DDR5 SODIMM memory module with up to 4800 MT/s and 8GB RAM, commercial temp 0°C to +60°C |
| DDR5-SODIMM-4800 (16GB) | 068902 | DDR5 SODIMM memory module with up to 4800 MT/s and 16GB RAM, commercial temp 0°C to +60°C |
| DDR5-SODIMM-4800 (32GB) | 068903 | DDR5 SODIMM memory module with up to 4800 MT/s and 32GB RAM, commercial temp 0°C to +60°C |
| DDR5-SODIMM-4800 ECC (16GB) | 068912 | DDR5 SODIMM memory module with up to 4800 MT/s and 16GB RAM with ECC, commercial temp 0°C to +60°C |
| DDR5-SODIMM-4800 ECC (32GB) | 068913 | DDR5 SODIMM memory module with up to 4800 MT/s and 32GB RAM with ECC, commercial temp 0°C to +60°C |

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## Notes / Legal (as shown)

All data is for information purposes only. Although all the information contained within this document is carefully checked, no guarantee of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with congatec GmbH. Product not yet released for Mass Production. Preliminary Revision 0.3 – March 10th 2026. © 2026 congatec GmbH. All rights reserved.