# 11TH GEN INTEL® CORE™ PROCESSORS — conga-HPC/cTLU www.congatec.com ## Form Factor / CPU / DRAM / Graphics / Display / Ethernet / I/O Interfaces / Audio / Board controller / Embedded BIOS Feature / Security / Power Management / Operating Systems / Temperature Range / Humidity / Size **Form Factor:** COM-HPC, Size A (95 × 120 mm), Client Connector Pinout ### CPU | Processor | Cores/Threads | Base Frequency/max. Turbo | TDP | Graphics | Intel Use Condition | |---|---:|---:|---:|---|---| | Core™ i7-1185G7E | 4C/8T | 1.80 GHz / 4.40 GHz | 12–28W | 96EU | Embedded Broad Market | | Core™ i5-1145G7E | 4C/8T | 1.50 GHz / 4.40 GHz | 12–28W | 80EU | Embedded Broad Market | | Core™ i3-1115G4E | 2C/4T | 2.20 GHz / 3.90 GHz | 12–28W | 48EU | Embedded Broad Market | | Celeron 6305E | 2C/2T | 1.80 GHz / -- | 15W | 48EU | Embedded Broad Market | | Core™ i7-1185GRE | 4C/8T | 1.80 GHz / 4.40 GHz | 12–28W | 96EU | Industrial | | Core™ i5-1145GRE | 4C/8T | 1.50 GHz / 4.10 GHz | 12–28W | 80EU | Industrial | | Core™ i3-1115GRE | 2C/4T | 2.20 GHz / 3.90 GHz | 12–28W | 48EU | Industrial | ### DRAM Up to 2× DDR4 SO-DIMM sockets for memory modules up to 32 Gbyte and 3200 MT/s each | 64 GByte maximum memory capacity ### Graphics Integrated Xe Gen 12 graphics engine with up to 96 Execution Units Supporting 4 independent display units (4 × 4k/2 × 8K) | Enhanced media (AV1/12b) with up to 2 Vdbox Next Gen IPU6 with DPHY2.1 | DP 1.4 ### Display 3 × DP/DP++ | 1 × eDP ### Ethernet 2 × 2.5 GbE with TSN support via Intel® i226 Ethernet controller series ### I/O Interfaces 4 × PCIe Gen4 | 8 × PCIe Gen3 2 × USB 4.0 | 2 × USB 3.2 | 8 × USB 2.0 2 × SATA III (6Gb/s) | SPI | 2 × UART | 12 × GPIO | 8 × MIPI-CSI ### Audio 1 × HDA (default) shared with I2S | 2 × SoundWire ### congatec Board controller Multi-stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control Hardware Health Monitoring | POST Code redirection ### Embedded BIOS Feature AMI Aptio® UEFI firmware | 32 Mbyte serial SPI with congatec Embedded BIOS feature | OEM Logo OEM CMOS Defaults | LCD Control | Display Auto Detection | Backlight Control | Flash Update ### Security Trusted Platform Module (TPM 2.0) ### Power Management ACPI 5.0 with battery support ### Operating Systems Microsoft® Windows 11 IoT Enterprise | Microsoft® Windows 10 | Microsoft® Windows 10 IoT Enterprise | Microsoft® Windows IoT 10 Core | Linux | Android | Yocto | RTS Hypervisor ### Temperature Range Commercial: Operating Temperature: 0 to +60°C Industrial: Operating Temperature: -40 to +85°C Storage Temperature: -20 to +80°C | Storage Temperature: -40 to +85°C ### Humidity Operating: 10 to 90% r. H. non cond. Storage: 5 to 95% r. H. non cond. ### Size 95 × 120 mm² ## Highlights - Low-power 11th Gen Intel® Core™ Processor - Integrated high performance Xe (Gen 12) graphics with 96 Execution Units - Extended temperature processors available - PCI Express Gen 4 - AI/DL Instruction Sets including VNNI --- ## conga-HPC/cTLU | Block Diagram **COM-HPC Client Type Connectors** - 2.5 GbE - 2.5 GbE - USB2.0 0 - USB4 1 - USB4 2 - USB4 3 - -7 - USB4 0 - GPIO 0-11 - UART 0-1 - I2C 0-1 - SoundWire 1 - PCIe 0 - PCIe 1 - PCIe 2 - PCIe 3 - PCIe 4 - SATA 0 - SATA 1 - DDI 0 - DDI 1 - DDI 2 - eDP - HDA / I2S - -7 - PCIe 8-11 - Boot SPI - SM Bus - GP SPI - SO-DIMM 0 - SO-DIMM 1 - congatec Board Controller - TMP 2.0 SPI Flash 11th Gen. Intel® Core™ SOC “Tiger Lake UP-3” - USB 3.2 - USB 3.2 - MIPI CSI 0 - MIPI CSI 1 - SoundWire 0 --- ## conga-HPC/cTLU | Order Information All data is for information purposes only. Although all the information contained within this document is carefully checked, no guarantee of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with congatec GmbH. Product not yet released for mass production. Revision 2.4 – July 2023 © 2023 congatec GmbH All rights reserved. | Article | PN | Description | |---|---|---| | conga-HPC/cTLU-i7-1185G7E | 050600 | COM-HPC Size A module based on Intel® Core™ i7-1185G7E 4-core processor with 1.8GHz up to 4.4GHz turbo boost, 12MB cache, Intel® Iris® Xe Graphics with 96EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake-UP3). Embedded temperature range 0°C to 60°C. | | conga-HPC/cTLU-i5-1145G7E | 050601 | COM-HPC Size A module based on Intel® Core™ i5-1145G7E 4-core processor with 1.5GHz up to 4.1GHz turbo boost, 8MB cache, Intel® Iris® Xe Graphics with 80EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake-UP3). Embedded temperature range 0°C to 60°C. | | conga-HPC/cTLU-i3-1115G4E | 050602 | COM-HPC Size A module based on Intel® Core™ i3-1115G4E 2-core processor with 2.2GHz up to 3.9GHz turbo boost, 6MB cache, Intel® Graphics with 48EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake-UP3). Embedded temperature range 0°C to 60°C. | | conga-HPC/cTLU-6305E | 050603 | COM-HPC Size A module based on Intel® Celeron® 6305E 2-core processor with 1.8GHz, 4MB cache, Intel® Graphics with 48EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake-UP3). Embedded temperature range 0°C to 60°C. | | conga-HPC/cTLU-i7-1185GRE | 050610 | COM-HPC Size A module based on Intel® Core™ i7-1185GRE 4-core processor with 1.8GHz up to 4.4GHz turbo boost, 12MB cache, Intel® Iris® Xe Graphics with 96EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake-UP3). Embedded temperature range -40°C to 85°C. | | conga-HPC/cTLU-i5-1145GRE | 050611 | COM-HPC Size A module based on Intel® Core™ i5-1145GRE 4-core processor with 1.5GHz up to 4.1GHz turbo boost, 8MB cache, Intel® Iris® Xe Graphics with 80EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake-UP3). Industrial temperature range -40°C to 85°C. | | conga-HPC/cTLU-i3-1115GRE | 050612 | COM-HPC Size A module based on Intel® Core™ i3-1115GRE 2-core processor with 2.2GHz up to 3.9GHz turbo boost, 6MB cache, Intel® Graphics with 48EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake-UP3). Industrial temperature range -40°C to 85°C. | | conga-HPC/cTLU-CSA-HP-B | 050658 | Standard active cooling solution for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 29mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole. | | conga-HPC/cTLU-CSA-HP-T | 050659 | Standard active cooling solution for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 29mm height and integrated 12V fan. All standoffs are M2.5mm thread. | | conga-HPC/cTLU-CSP-HP-B | 050660 | Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 28mm height. All standoffs are with 2.7mm bore hole. | | conga-HPC/cTLU-CSP-HP-T | 050661 | Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 28mm height. All standoffs are with M2.5mm thread. | | conga-HPC/cTLU-HSP-HP-B | 050662 | Standard heatspreader for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 13mm height. All standoffs are with 2.7mm bore hole. | | conga-HPC/cTLU-HSP-HP-T | 050663 | Standard heatspreader for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 13mm height. All standoffs are with M2.5mm thread. | | conga-HPC/EVAL-Client | 065600 | Evaluation Carrier Board for COM-HPC Client type Modules. | www.congatec.com