## Computer-on-Modules – the Compendium ### What, when, why, where and how? Whitepaper --- ## Table of contents Computer-on-Modules – a short introduction 3 Off-the-shelf super-component 3 Evolution of open Computer-on-Module standards 4 COM benefits at a glance 5 The COM approach – buy and build 6 COMs – the golden design choice 8 Simplified customization via carrier boards 10 Less interfaces, more benefits 11 Reduced complexity of associated tasks 11 Carrier design guides 11 Training and support 12 Checklist for the COM approach 12 Reduced efforts for deployed devices 13 COM standards – not all COMs are created equal 13 COM-HPC – the game changer 16 COM-HPC Mini 17 COM-HPC Client 18 COM-HPC Server 20 COM Express 22 COM Express Type 10 (Mini) 23 COM Express Type 6 24 COM Express Type 7 26 SMARC module 28 Conclusion 30 aReady. 32 Small form factor module standards in comparison 34 Performance class modules in comparison 36 Server-class module standards in comparison 38 COM Express module types in comparison 40 COM-HPC module types in comparison 42 --- ## Computer-on-Modules – a short introduction In contrast to conventional computer boards like Single Board Computers (SBCs) and motherboards, COMs do not work stand-alone. Instead, they need an additional board that carries the COM, the application-specific circuitry, and external interfaces. This carrier board can have any shape and size as long as the design is not smaller than the connector between module and carrier. There are many different types of computer modules, referred to by names like System-on-Modules (SoMs) and Computer-on-Modules (COMs). Since the latter is more common and more precise, this paper will stick to Computer-on-Modules or COMs. But in general, both mean the same: A circuit board that contains the core building blocks of an embedded computer. ### Off-the-shelf super-component The beauty of Computer-on-Modules is that they are available off-the-shelf as application-ready super-components. In a single, function-validated package they feature all key building blocks and interfaces of an embedded computer including: ► Processing unit (CPU), sometimes with integrated graphics and AI accelerators ► RAM, memory modules or soldered down for the rugged versions, ► Graphics, Ethernet, USB, GPIO, etc. ► Controllers for additional interfaces including real-time Ethernet, CAN bus, MIPI CSI, Thunderbolt on selected SKUs, etc. ► Non-volatile memory for OS and data storage on selected SKUs OEMs can buy Computer-on-Modules with all required board support packages including drivers and software tools. Optional accessories like tailored cooling solutions and evaluation carrier boards are often also offered. Designers can choose between proprietary COMs and modules following open standards. It is highly recommended to leverage COMs based on open standards as they make full use of the modular approach and offer unique advantages. --- ## Evolution of open Computer-on-Module standards Moore’s Law for Computer-on-Modules The number of transitions that fit on a specific Computer-on-Module form factor doubles approximately every 2 years. ModulAT ► AT/ISA96 bus ► 120 pins ► Intel 80C88 ETX/XTX ► ISA/PCI bus ► 400 pins Intel Pentium 4 Foundation of ETX-IG Open specifications enable COM VIA Eden Intel Pentium III ► Cracks 1GHz limit 1999 2001 2023 2016 2008 2003 2000 1993 2021 2013 2005 COM-HPC Mini ► Up to 16×PCIe Gen 6 ► 400 pins ► Video/audio interfaces ► Soldered RAM Server-on-Modules Introduction of COM Express Type 7 SMARC Module ► Industrial grade interfaces ► 314 pin MXM 3 connector ► For Arm and x86 ► Extended industrial I/O Qseven ► 70mm×70mm ► Industrial grade interfaces ► 230 pin MXM 2 connector ► For Arm and x86 COM Express ► Pure serial PCIe bus ► 440 pins a quantum leap ► Basic & Compact dominate Intel Pentium M The COM milestone processor COM-HPC/Client ► Up to PCIe Gen 5 ► 800 pins ► Video/audio interfaces ► Up to 4 SODIMM memory COM-HPC/Server ► Up to 64×PCIe Gen 5 ► 800 pins ► Headless ► 8 DIMM memory --- ## COM benefits at a glance ### Faster time-to-market COMs save time as they separate the application-specific design work from the underlying embedded computing technology. Designers can fully concentrate on their core competencies and leave the computing functionality to the COM. ### Reduced design risk COMs minimize risk. Basic changes during the design phase, or in the middle of a product’s lifecycle, are easily managed. Simply plug in the next-generation computer module and continue. Easily design whole product families using different COMs from one basic design. ### Lower development cost COMs save money compared to full-custom designs by reducing the non-recurring engineering costs for development and upgrades. With standardized COMs, developers don’t have to spend time on a complex design in process. ### Maximized ROI & sustainability COMs increase the lifetime of your application. Existing designs can easily be upgraded to fulfill new and unforeseen demands with a simple module change. Even systems that have been in use for several years can be upgraded, extending the lifespan of your hardware. ### High investment security COMs enable seamless migration to newer technologies and different providers, making your applications independent from technological changes, obsolescence issues, and technology provider. This preserves compatibility and software investments. ### Increased agility COMs are highly scalable to meet all performance requirements, from low power to high performance, and from Arm technology to x86. Conquer the challenges of rapid technological evolution with a simple module change to implement more performance and new possibilities like AI. COM benefits at a glance --- ## The COM approach – buy and build One of the fundamental questions regarding the embedded computing technology when developing a new application is: Shall I build, or shall I buy? ### Pros and cons for build Building a full-custom design leads to a highly optimized solution. The shape and features can be tailored to meet the exact requirements of the application in a cost-optimized package. But a full-custom design requires substantial upfront investments in development resources, monetary costs, and time. Moreover, future upgrades, for example with more powerful and energy-efficient processors, often require a complete re-design of the existing solution. But in many cases, the biggest trade-offs are missing expertise and/or resources to design-in the complex core PC components. ### Pros and cons for buy At the other end of the scale are off-the-shelf motherboards. Buying a commercial motherboard is typically the fastest way to the application. Moreover, this route also comes with high design security as customers purchase a fully verified and reliable design. However, there are some drawbacks to this approach. Designers frequently pay for more features than they really need. The boards may not fit the available box space nor provide the required number of interfaces in the right configuration or board location. Utilizing PCIe expansion cards on the board may not provide the required resistance against mechanical or thermal stress. And sometimes, standardized boards just don’t offer the required scalability due to unavailable processor options. Integration cost Sweet spot Sweet spot Unit cost 1 ~1k ~20k >100k Low volume High volume --- ## COMs – the golden design choice In contrast to full-custom designs, engineers neither have to integrate complex processors, RAM and high-speed interfaces, nor build entire board support packages with all associated drivers, libraries and APIs themselves. Instead, all these components come off-the-shelf from the respective module vendor. This enables engineers to concentrate fully on optimizing the dedicated application, which after all is their core competency. Besides R&D, purchasing departments also benefit from COMs since the bill of materials (BOM) is reduced from multiple components to a single module for the processing core. Admittedly, this is a smaller but nevertheless important part of the efficiency gains from Computer-on-Modules. ### Highest scalability Computer-on-Modules offer tremendous scalability for upgrading processing power. With a full-custom design, a direct processor change can only be executed using pin-compatible processors. However, in most cases, successor processors are not pin-compatible. When leveraging a customized board, designers would have to re-design their PCB. With Computer-on-Modules, a switch between processor generations and vendors is much simpler and always possible. A new product generation can be launched just by exchanging the module. Another advantage is the long-term availability of applications. When the multi-year product lifecycle of an embedded processor ends, a module with a successor is often available for a seamless retrofit. Between these two designs paths, Computer-on-Modules provide the optimal route for designers. COMs decouple the application-specific design work from the underlying, highly complex embedded computing technology. ### Open standards are a must However, high scalability can only be secured through standardization. Computer-on-Modules achieve this by utilizing open standards. These define aspects such as module footprints, type and number of connectors, signals routed to the carrier board, and maximum power consumption. The benefits of open standards for COMs are tremendous. Standardization leads to highest design security as it guarantees future availability of modules with the same interfaces. Designers can also develop second source strategies and are not dependent on a single vendor. This increases both design security and availability as disruptions in the supply chain can be compensated for by other vendors. PICMG SGET COM Express SMARC COM-HPC Qseven Standardization further delivers the capability to offer a broad ecosystem of commercially available accessories, ranging from heat spreaders and carrier boards to cable sets and housings. This makes it easy to purchase components from third parties, reducing NRE costs to a minimum. Finally, a large community of designers working with the form factor ensures continuous standard improvements. The most important vendor-independent computer module standards are COM-HPC® and COM Express® from the PCI Industrial Computer Manufacturers Group (PICMG), and SMARC and Qseven from the Standardization Group for Embedded Technologies e.V. (SGET). ### Standardized cooling These standards go beyond defining modules alone. They also cover corresponding heat spreaders, which act as thermal interfaces between modules and system cooling solutions. All heat-generating components thermally conduct to these heat spreaders to avoid hot spots. Moreover, the standards define an overall z-height for conformity. The heat spreaders level out variances in CPU and component heights on the modules. As a result, the overall height from cage top to heat spreader top is always the same within a given standard. This ensures that modules are interchangeable even when directly coupled to system housings for passive heat dissipation. --- ## Simplified customization via carrier boards With COMs, customization is implemented via carrier boards. Designing a customized carrier is far less complex than designing a full-custom board, yet provides identical benefits. Compared to standard motherboards, carrier boards offer complete footprint and interface flexibility. The footprint can be quadrangular, round, or entirely asymmetric. This offers perfect conditions for tailoring the PCB to the system and yields many benefits, from optimized cooling and more rugged mounting to the ability to position I/Os exactly where required. This eliminates the need for complex internal cabling, which improves reliability and system design. Additional controllers for application-specific peripherals are easily implemented via the carrier, too. This eliminates the need for conventional expansion boards, which are often prone to mechanical stress and can reduce system reliability while increasing BOM and cost. This way, engineers can fully concentrate on the customization, which simplifies and accelerates the design process. As previously mentioned, Computer-on-Modules derive their greatest strength from following standards. But how do you customize COM designs, and how do they compare against off-the-shelf motherboards or SBCs? --- ## Less interfaces, more benefits In contrast to conventional SBCs and motherboards, COM-based carrier boards only integrate what the application needs. This brings cost gains as the design does not feature unnecessary components. This also helps to increase security, because an interface that is not there cannot be compromised or hacked. Take for example external USB ports, which may not be required by the application but are standard in motherboards. These ports represent an open door for data theft and malware. ### Carrier design guides Both the PICMG and SGET standard bodies provide verified design guides for carrier board development, guiding OEMs through all the required best practices of designing application-specific carrier boards. These carrier board design guides are a great educational base for embedded computing engineers and their availability has led to advanced standardization: Most custom-specific carrier boards are designed in line with the best practices described in the guides. With many vendors delivering the blueprints of their evaluation carrier designs to OEM customers in appropriate files, engineers can also leverage considerable efficiency gains by re-using existing carrier board layouts. With embedded and edge system engineers having to navigate ever shorter design cycles, these carrier board design guides are a great help to get high-quality designs to market faster. You can find the carrier design guides for COM-HP and COM Express at PICMG website www.picmg.org/resources/design-guides You can find the carrier design guide for SMARC Module at: sget.org/standards/smarc ### Reduced complexity of associated tasks Compared to a full-custom design, the COM approach reduces not only the engineering and design efforts; other associated tasks are also easier to fulfil: ► Evaluation and verification are limited to components that are not provided by the modules and evaluation carrier boards. All other components are pre-validated by the board vendor. ► OEMs can utilize the already finalized documentation for the Computer-on-Modules, only needing to tweak the evaluation carrier board specifics to arrive at their own final carrier board documentation. This means that at least 60% of the documentation effort for this system component is completed out-of-the-box, which frees engineers from this unloved task. ► Tests and certifications are limited to the application-specific components, which simplifies certification of the overall system. --- ## Checklist for the COM approach COMs are a good fit when your application requires at least one of the following features: Application-specific I/O set Customized form and size High scalability Long-term availability Upgradability High design security Fast time-to-market Optimized development cost High design agility High re-use of existing designs You should consult a COM vendor when you run into one of the following challenges: Your required processing unit is not available on standard modules, not even on the processor-agnostic COM-HPC standard Your required z-height is lower than COMs provide You require very high production volumes But even in those cases, the COM approach and vendor will likely be able to help, for instance by designing a dedicated module solution with the required processing unit on a project basis. This can be done via the processor-agnostic COM-HPC standard. For the last two demands, a COM and carrier fusion can be helpful. Here, the required COM and carrier combination is transferred into a single board solution to find the financial sweet spot. Finding the sweet spot Calculating this breakeven point is complex as R&D costs and future upgrade investments must also be taken into account. congatec can help OEMs with these calculations, and it can also provide embedded design and manufacturing services for full-custom boards. ### Training and support As Computer-on-Module vendors strive to provide the best services and support for their modules, customers have access to various offerings ranging from online tutorials and carrier board design training to integration services. congatec offers premium support in this area, having installed a personal service for OEMs that is designed to further simplify the use of embedded computing technologies. OEM customers around the globe benefit from a single point of contact to get all their design-in questions answered. There is no need to wait in an impersonal hotline or speak to constantly changing contact persons. congatec’s premium service for OEM customers is simple, straightforward and comfortable for engineers – unique in the embedded computing market, and globally available at no extra costs. Do vendors of standard motherboards offer such services? No! So, who should developers of full-custom designs contact to get quality help with their design challenges? It will most likely be down to the Computer-on-Module vendors to offer best-in-class services and support. --- ## Reduced efforts for deployed devices As device connectivity increases, embedded systems can no longer deploy with frozen OS and application configurations. Full-custom designs place the burden of managing security updates for all components in the system on OEMs. With Computer-on-Modules, OEMs find a strong partner in their module vendor who offers regular updates for the computing core and its standard BIOS, firmware and drivers. ## COM standards – not all COMs are created equal While COMs are as close to a unified, one-size-fits-all design approach as you can get, there is no single, universal COM standard. Currently, there are three state-of-the-art standards from two worldwide standardization bodies: 1. The PCI Industrial Computer Manufacturers Group (PICMG) hosting the performance-oriented COM-HPC and COM Express standards 2. The Standardization Group for Embedded Technologies e.V. (SGET), which maintains the low-power-optimized SMARC module and Qseven specifications All available form factors as defined by the COM-HPC, COM Express, SMARC module, and Qseven specifications. --- ## The current standards 1 Low-Power Class Performance Class Server Class CPU Support x86 Arm Other (FPGA, GPGPU, etc.) Scalability Performance Footprint I/Os Range and number Bandwidth 1 Although still actively supported, developers should not base their new SFF applications on Qseven. With COM-HPC Mini and SMARC module there are two highly capable new standards that offer more benefits. This paper will therefore not address Qseven in detail. --- COM-HPC Server Brings datacenter-grade performance to the industrial edge COM-HPC Size E 200 x 160 mm COM-HPC Size D 160 x 160 mm COM-HPC Server is the first standard that has been designed from the ground up for powerful edge servers. COM-HPC Server allows edge server installations to break free from the tight thermal constraints of air-conditioned server rooms. Server modules can be combined with other COM-HPC modules in one multi-module system. Size & form factor The COM-HPC Server standard specifies two footprints – Size D (160mm×160mm) and Size E (200mm×160mm). These dimensions provide enough headroom for current and upcoming server processors with massive core count. Just like COM-HPC Client, Server modules also feature construction heights of either 5mm or 10mm from carrier board top to module bottom, depending on the connector. For both heights, the unifying heat spreader adds another 18mm. The extra height of 3mm compared to COM-HPC Client is required to support more powerful and socketed server processors. In total, COM-HPC Server modules feature total design heights of 23mm or 28mm including heat spreader. COM-HPC Server modules can host up to 4 SDRAM sockets on Size D, and up to 8 on Size E for highest memory capacities with fastest data transfer rates. Connector & interfaces COM-HPC Server uses two connectors with 400 signal pins each to the carrier board, just like the Client modules. However, the distance between the connectors differs. This protects the modules, preventing that Client and Server modules, which are electrically incompatible, are accidentally plugged in the wrong carrier board. With 800 pins, COM-HPC Server modules offer the highest PCIe lane capacity and networking bandwidth currently available on Computer-on-Modules. COM-HPC Server omits the graphic interfaces of Client in favor of more and higher-performing networking interfaces and PCIe lanes. These are required to accelerate intersystem communication, as well as to handle immense amounts of raw data, connect additional compute accelerators like GPGPUs, ASICs, or FPGAs, and save information on fast NVMe SSD clusters. The up to 8×Ethernet interfaces are designed as 25GBASE-KR. This allows designers to choose their preferred PHY and implement it on the carrier board. It also gives them full freedom to define whether the data is transmitted via copper or fiber optic cables. For even more flexibility, the PHY can be implemented as exchangeable SFP+ modules, which makes it possible to delay the decision whether to transfer via copper or fiber optics until installation on site. To ensure compliance with IEEE 1588, the feature set of the COM-HPC Server 25GBASE-KR interfaces also includes a software-defined pin to specify if the interface acts as input or output. It is controlled by the corresponding Ethernet controller. This enables the implementation of a hardware-based timing protocol in accordance with IEEE 1588 for high-performance real-time applications. Other than the Client and Mini modules, the Server modules operate from a fixed 12 Volt power source. The maximum power budget of COM-HPC Server modules is as high as 358 Watt. COM HPC Server 2x USB 4.0 2x USB 3.1 4x USB 2.0 2x SATA 12x GPIO 2x UART eSPI, 2x SPI SMB, 2x I2C, IPMB 1x NBaseT (max. 10 Gb) Power 12V DC 8x 25GBE KR 65x PCIe --- COM Express COM Express is the very first vendor-independent COM standard defined by the PICMG. It was officially launched in 2005 as a successor of ETX modules (hosted by an industry group). The widespread introduction of the new PCI Express bus and the elimination of ISA support in processors and chipsets in the early 2000s laid the foundation for COM Express, which in the first versions also supported the PCI bus. Since its introduction, COM Express has undergone many improvements, adapting it to the latest state-of-the-art technologies. One example is the introduction of the Type 7 Server-on-Module pinout for high-bandwidth networking. COM Express Computer-on-Modules are available in three application classes defined by their respective pinout: Type 10 for extremely small low-power applications, Type 6 for client designs with graphics, and Type 7 for headless server designs. Just like COM-HPC, COM Express also offers extraordinary scalability. All COM Express modules use the same high-pin connector with 220 pins. COM Express Type 6 and Type 7 modules use two of those connectors, for a total of 440 pins. COM Express Mini with the Type 10 pinout leverages a single connector with 220 pins. Unlike COM-HPC or SMARC, COM Express modules are optimized for x86 technology alone. COM Express is the best example of the long-term benefits of Computer-on-Modules. Developed back in 2005, it is still up to date today, featuring the latest processor and interface technologies and serving as a great basis for powerful embedded designs. At the COM Express page www.picmg.org/openstandards/com-express designers can find the following assets: - COM Express® Module Base Specification Rev 3.1 - Embedded EEPROM specification for COM Express The Carrier Board Design guide can be downloaded for free: www.picmg.org/resources/design-guides --- COM Express Type 10 (Mini) PICMG’s smallest Computer-on-Module standard The COM Express Type 10 pinout is directly connected to the COM Express Mini form factor. It has been specifically developed to enable SFF designs based on power-saving x86 technology. The COM Express Type 10 pinout and Mini form factor were introduced in 2012. Size & form factor COM Express Mini is the smallest Computer-on-Module footprint specified by PICMG, measuring only 84mm×55mm. It targets extremely compact and/or mobile applications that require the highest level of integration and powerful graphics combined with longer battery life. Designers can choose between 5mm and 8mm stack height options (module bottom surface to carrier board top surface). Together with the standardized cooling solution, COM Express Mini designs feature total construction heights of 18mm or 23mm. COM Express Mini modules shall use soldered memory to save space on the PCB. Connector & interfaces COM Express Mini is based on the same proven connector as the other footprints. But Type 10 specifies only one connector with an optimized pinout to feature all relevant interfaces for space-constrained applications. MIPI CSI cameras can be connected via up to two dedicated connectors on the module. Compared to COM Express Type 6 modules, the Mini specification offers the same range of interfaces, only their number is reduced. In keeping with the smaller footprint, COM Express Mini modules also feature a small power budget totaling 68 Watt. This limit provides still far more headroom than most designs require. Unique to Type 10 COM Express Mini modules is the optional wide-range power input from 4.75 to 20 Volt. This enables easy integration in battery-powered devices as well as in-vehicle applications. The normal operating voltage is 12 Volt. Type 10 Gigabit Ethernet LPC 4x PCIe HDA DDI 2x SATA 8x USB 2.0 / 2x USB 3.0 8x GPIO / SDIO 2x SER / CAN SPI & I2C Power LVDS 1x24 / eDP COM HPC Mini 95x70mm2 A B COM Express Mini COM Express Compact&Basic 13.0 mm 21.0 mm 8.0 mm 13.0 mm 18.0 mm 5.0 mm 13.0 mm 21.0 mm 8.0 mm 13.0 mm 18.0 mm 5.0 mm --- COM Express Mini COM Express Compact&Basic 13.0 mm 21.0 mm 8.0 mm 13.0 mm 18.0 mm 5.0 mm 13.0 mm 21.0 mm 8.0 mm 13.0 mm 18.0 mm 5.0 mm --- COM Express Type 6 The most successful multi-purpose standard COM Express Type 6 modules cover a broad range of multi-purpose embedded applications. With their extensive interface range, they provide everything needed to build powerful PLCs, HMIs, shop floor systems, or SCADA workstations. Further application areas are high-end digital signage systems, complex kiosk systems, as well as autonomous mobile robots. Size & form factor A B C D COM Express Extended 155x110mm2 A B C D COM Express Basic 125x95mm2 A B C D COM Express Compact 95x95mm2 For COM Express Type 6 modules PICMG specifies three sizes: Extended with 155mm×110mm, Basic measuring 125mm×95mm, and Compact with 95mm×95mm. The most common form factors are Compact and Basic, whereas Extended modules typically feature the most powerful and usually socketed processors. Just like COM Express Mini, the Compact, Basic and Extended modules also feature stack heights of 5mm or 10mm from carrier board top to module bottom. For both heights, the unifying heat spreader adds another 13mm. COM Express Basic and Compact modules typically offer one or two stacked SO DIMM sockets for memory. Rugged versions can also feature soldered memory or a combination for even higher capacities. The larger Extended modules can also carry full-size DIM modules with higher bandwidth. Connector & interfaces COM Express Type 6 uses two connectors with 220 signal pins each to the carrier board, just like Type 7 modules. Although Type 6 and Type 7 modules are electrically incompatible, the modules are protected against damage if a module is plugged onto the wrong carrier. The total of 440 pins allows COM Express Type 6 modules to use more power lanes as well as significantly more I/Os than Mini modules. With 24 PCIe lanes, Type 6 modules feature six times the bandwidth of COM Express Mini and offer 4 display interfaces instead of one. Just like with Mini, two MIPI CSI cameras can be connected via dedicated connectors on the module. COM Express Compact and Basic modules typically host up to two SO-DIMM sockets or soldered memory for rugged designs. COM Express Compact and Basic modules operate from a 12 Volt power source. The maximum power budget of these footprints is as high as 137 Watt. Gigabit Ethernet LPC HDA ExpressCard 4x SATA 8x USB 2.0 8x GPIO / SDIO 2x SER / CAN SPI & I2C Power Power 3x DDI COM Express Type 6 4x USB 3.0 8x PCIe LVDS / eDP PEG x16 --- COM Express Type 7 The entry point for rugged edge servers Size & form factor COM Express Type 7 modules are typically available in the Basic footprint (125mm×95mm). These dimensions provide enough space even for the typically larger embedded server processors that require a greater surface for effective heat dissipation. COM Express Type 7 Server-on-Modules also feature stack heights of 5mm or 10mm from carrier board top to module bottom, but overall heights with heat spreader measure 18mm or 23mm. COM Express Type 7 Server-on-Modules typically offer two stacked SO-DIMM sockets for memory. Here too, the extended form factor is rarely used as the increased space is not required by today’s CPUs, which must stay within the defined power range of COM Express. The COM Express Type 7 Server-on-Modules were added to the COM.0 specification in 2017. These modules extend the use cases for COM Express to modular edge server designs, which are being deployed at the rugged edge of the IoT and Industry 4.0. A B C D COM Express Basic 125x95mm2 Just like Type 6 modules, Type 7 Server-on-Modules also operate from a 12 Volt power source. The maximum power budget of these footprints is as high as 137 Watt. Connector & interfaces COM Express Type 7 uses the same connectors as Type 6 modules. However, the supported interfaces have been optimized to the high bandwidth demands of today’s edge server designs. Compared to Type 6, the Type 7 Server-on-Modules omit all graphics, sound, and camera interfaces in favor of more and higher bandwidth interfaces. A major change is the addition of 8 more PCIe lanes, summing up to 32 lanes in total, to connect more storage and compute accelerators like GPGPUs. Moreover, Type 7 supports up to 4×10Gb Ethernet with side band signals. Also, to address the demands of embedded server technology, COM Express Type 7 reserves pins for an intelligent platform management bus (IPMB) interface. Just like COM-HPC Server, the 10 GbE interfaces on COM Express Type 7 are designed as 10GBASE-KR single backplane lanes (see also IEEE 802.3 / 49). The PHY is to be implemented on the carrier board, which gives designers the freedom to define whether the data is transmitted via copper or fiber optic cables. For even more flexibility, the PHY can be implemented as exchangeable SFP+ modules, which makes it possible to delay the decision whether to transfer via copper or fiber optics until installation on site. To ensure compliance with IEEE 1588, the feature set of the COM Express 10GBASE-KR interfaces also includes a software-defined pin for each of the four interfaces. This physical pin can be configured as input or output and is controlled by the corresponding Ethernet controller. This enables the implementation of a hardware-based timing protocol in accordance with IEEE 1588 for high-performance real-time applications. Gigabit Ethernet LPC / eSPI 2x SATA 4x USB 2.0 8x GPIO / SDIO 2x SER / CAN SPI & I2C Power Power 32x PCIe 4x 10GBaseKR COM Express Type 7 4x USB 3.0 --- SMARC module SMARC (Smart Mobility ARChitecture) Module is an open standard specifically designed for low-power credit-card-sized Computer-on-Modules. It was introduced in 2012 by the SGET. SMARC module is designed to enable digital transformation even at the outer edge for size, weight, power and cost (SWaP-C) sensitive applications. The SMARC module specification is available for free download at SGET: sget.org/standards/smarc Size & form factor SMARC defines two module sizes measuring 82mm×50mm and 82mm×80mm. The larger size is defined but is practically not in use today. Compared to COM Express Type 10 and COM-HPC Mini, SMARC modules offer a very low-profile solution. The defined z-height from carrier top to module bottom is as low as 1.5mm. Together with the specified heat spreader, SMARC designs feature an overall height of only 11.7mm. This is by far the lowest construction height of all open COM standards. SMARC module For size, weight, power and cost-optimized AI applications at the rugged edge 5.0 mm 7.8 mm 10.2 mm 15.2 mm 5.5 mm 10.2 mm 2.7 mm 12.9 mm 4.3 mm 1.5 mm 10.2 mm 11.7 mm COM-HPC Size E 200 x 160 mm COM-HPC Size D 160 x 160 mm COM-HPC Size C 160 x 120 mm COM-HPC Size B 120 x 120 mm COM-HPC Size A 95 x 120 mm COM Express Basic 125x95mm2 COM Express Compact 95x95mm2 COM-HPC Mini 95 x 70 mm Qseven 70x70mm2 COM Express Mini 84x55mm2 SMARC module 82x50mm2 --- Connector & interfaces SMARC module builds upon the common MXM 3 connector, which is backed by broad industry support due to its use with notebook graphics cards. Thanks to this card-edge connector, SMARC enables exceptionally slim and rugged designs. Despite its space-saving design, the MXM 3 connector features 314 signal pins. This provides ample room for a broad range of interfaces tailored to state-of-the-art industrial, medical, in-vehicle, and robotics applications that integrate powerful imaging features for situational awareness. Consequently, SMARC features a rich set of graphics-oriented interfaces including 3 display outputs, up to 4 MIPI CSI inputs for cameras, as well as 4 PCIe lanes, 6 USB ports, and 2 CAN bus interfaces to connect to further peripherals. 2 Gigabit Ethernet ports with TSN support allow for vertical and horizontal integration in industrial networks. Processors & special features SMARC module is designed to host both leading processor architectures x86 and ARM. Besides the modules themselves, SMARC module also defines a unifying heat spreader to further standardize and simplify module integration as well as interchangeability. With its focus on low-power designs, SMARC module defines an input voltage between 3.0 and 5.25 Volt, and a maximum power consumption of 25 Watt (maximum peak power). However, ARM designs are typically in the range of only 6 Watt, and x86 designs between 5 and 12 Watt. Consequently, SMARC module features one of the best interface-per-watt ratios among all current COM standards. A unique feature of SMARC module is the optional on-module wireless functionality with a designated area for antenna connections. This simplifies the implementation of wireless connectivity in mobile and other applications as no additional controllers are needed on the carrier. SMARC 2.0 2x Gigabit Ethernet eSPI 4x PCIe HDA / 2x I2S LVDS 2x24 / eDP / MIPI DSI 2x MIPI CSI HDMI & DP++ 1x SATA 6x USB 2.0 / 2x USB 3.0 12x GPIO / SDIO 4x SER / CAN SPI / I2C Power --- Conclusion Computer-on-Modules offer substantial benefits over full-custom designs, including reduced development costs, a scalable product range, and faster time-to-market as developers can focus on the system features. This enables OEMs to react to market trends faster. Moreover, by utilizing Computer-on-Modules they can leverage a second source philosophy and minimize inventory costs. Identifying the best form factor is a major step within the design evaluation process. Module vendors that offer all the relevant form factors can help by providing expert consultancy as well as best options to migrate from one form factor to another. When choosing the right vendor, it is key to have a look at the offered BSPs, firmware, and communication middleware, as they are getting increasingly important in a connected world. This does not mean that the vendor should complement its offerings with an entire cloud for the system because it will never meet the needs of a customer entirely. It is more important to have a closer look at what is offered on the board and module level itself. Check that integration support is offered for Arm and x86, because it is better to employ one engineer who supports both architectures for a unified product family instead of two engineers for two separate product lines. This also requires unified APIs. Finally, check the provided documentation. It is better to have extensive content instead of only a bare minimum. And think also about relying on local manufacturing capacities wherever you or your customers reside. --- aReady. High-performance building blocks from COM to cloud simplify development Application-ready Computer-on-Modules from congatec congatec’s aReady. strategy is specifically designed to simplify the implementation and utilization of modern base technologies. With aReady. high-performance embedded building blocks, designers can focus on their core competencies and become an innovation driver in their industry. congatec’s constantly growing aReady. portfolio includes aReady.COM, aReady.IOT and aReady.VT, covering the most relevant use cases. aReady.COM reduces complexity of COM-based designs by seamlessly integrating hardware and software building blocks for unparalleled performance and flexibility. Benefits - Optimize time-to-market and design efforts by combining existing hardware and software building blocks. - Optimized cost and efficiency by reducing efforts for installation, compatibility testing and licensing. - Increased security by pre-evaluated hardware and software building blocks. - Reduced system size, weight, power, and cost by system consolidation. - Increased flexibility and scalability by simple extension with further building blocks. Customer Application Applications built on aReady.COMs are more agile and responsive. Operating Systems Layer Every aReady.COM comes with pre-installed and licensed operating systems fitted to your needs. Virtualization Layer Hypervisor-on-Module enables the consolidation of multiple applications to make full use of all resources. Hardware-Layer aReady.COMs facilitate flexible integration, enable easy upgrades to extend product lifecycles, and improve return on investment. Software Layer Pre-evaluated functional software building blocks minimize design efforts and compatibility concerns --- aReady.VT aReady.VT enables the full utilization of today’s multi-core performance. It allows for the consolidation of functionality that previously required multiple dedicated systems onto a single hardware platform. Benefits - Improved time-to-market and agility. - Reduced system size, weight, power and cost. - Full flexibility in system functionality. - Support from low-power modules to high-performance server designs. aReady.IOT aReady.IOT Building Blocks are designed for secure IoT connectivity from COM to cloud. Developers use them for secure connection between Operational Technology (OT) and Information Technology (IT). Benefits - High security by physical network separation VPN gateway function adds another security layer. - Enhanced communication via wireless and wired connectivity options. - Pre-configured for fast and easy roll-out. - High scalability enables digitization even across multiple locations. - High integration level ideal for system integrators. Hypervisor-on-Modules At congatec, the hypervisor is now standard in all new x86-based Computer-on-Modules. With the free trial license, designers can immediately start evaluating the advantages of virtualization. Find more information here. Hypervisor Additionally, the industry leading Hypervisor from Real-Time Systems is also available as a stand-alone software. IoT technology from congatec – for secure OT/IT connection from COM to cloud Virtualization technology from congatec – consolidate what belongs together --- Small form factor module standards in comparison COM-HPC Mini | COM Express 3.1 Type 10 (Mini) | SMARC 2.1 Module | Qseven Dimensions 95mm×70mm | 84mm×55mm | 82mm×50mm | 70mm×70mm / 40mm×70mm (µQseven) Connector height (module bottom to carrier board top) 5mm or 10mm | 5mm or 10mm | 1.5mm | 5mm Stack height (carrier board top to heat-spreader top) 15mm or 20mm | 18mm or 23mm | 11.7mm | (not shown) Max. power dissipation 91W | 68W | 25W | 12W Input voltage range 8–20V | 12V, optional wide-range input power of 4.75 to 20V | 3.0V to 5.25V | 4.75V to 5.25V Signal pins 400 | 220 | 314 | 230 PCIe¹ 16×PCIe Gen 6 | 4×PCIe Gen 4 | 4×PCIe Gen 3 | 4×PCIe Gen 3 Graphics¹ 3×DDi + 1×eDP | 1×DDI +1 LVDS/eDP DP++/HDMI + 1×DP++ + 2×LVDS/eDP/MIPI DSI | eDP/HDMI + 2×LVDS Sound1 HDA + SoundWire + I2S | 1×HDA/SoundWire | HDA + I2S | 1×HDA/I2S Camera in¹ 2×MIPI CSI via dedicated connectors on the module | 2×MIPI CSI via dedicated connectors on the module | 2×MIPI CSI + 2×MIPI CSI via dedicated connectors on the module – | – Ethernet¹ 2×10GbitE with TSN + 2×10GbitE (SERDES) with TSN | 1×1GbE with TSN | 4×1GbE with TSN | 1×1GbE with TSN Wireless Not supported | Not supported | Antenna connector for WiFi & Bluetooth | Not supported USB¹ 4×USB 4.0, 4×USB 3.2 ×1 / USB 3.2 ×1 + 8×USB 2.0 | 2×USB 3.2 + 8×USB 2.0 | 2×USB 3.0 + 6×USB 2.0 | 2×USB 3.0 + 8×USB 2.0 SATA¹ 2×SATA Gen 3 | 2×SATA Gen 3 | 1×SATA Gen 3 | 2×SATA Gen 3 CAN bus¹ 1× | 2× | 2× | 1× UART1 2× | - | 4× | 1× GPIO 12× | 8× | 14× | 8× Other eSPI, 2×SPI, SMB, 2×I2C | LPC/eSPI | eSPI, SPI, I2C, SDI | SPI, LPC, I2C, SDI ¹ Not all I/Os are available in parallel; some pins are shared. --- Small form factor module standards in comparison COM-HPC Mini | COM Express 3.1 Type 10 (Mini) | SMARC 2.1 Module | Qseven (continued table rows shown:) (Top rows not repeated) --- Performance class modules in comparison COM-HPC Mini | COM-HPC Client | COM Express Type 6 (Spec 3.1) Dimensions 95mm×70mm | 120mm×95mm (Size A) 120mm×120mm (Size B) 120mm×160mm (Size C) | 125mm×95mm (Basic) 95mm×95mm (Compact) Connector height (module bottom to carrier board top) 5mm or 10mm | 5mm or 10mm | 5mm or 10mm Stack height (carrier board top to heat-spreader top) 15mm or 20mm | 20mm or 25mm | 18mm or 23mm Max. power dissipation 91W | 251W | 137W Input voltage range 8–20V | 8–20V | 12V Signal pins 400 | 800 | 440 PCIe lanes¹ 16×PCIe Gen 6 | 49×PCIe Gen 6 | 24×PCIe Gen 4 Graphics¹ 3×DDi + 1×eDP | 3×DDI + 1×eDP | 3×DDI + 1×LVDS/eDP / VGA Sound1 SoundWire / HDA / I2S | 2×SoundWire / I2S / HDA | HDA (1×SoundWire optional) Camera in¹ 2×MIPI CSI via dedicated connectors on the module | 2×MIPI CSI | 2×MIPI CSI via dedicated connectors on the module Ethernet1 2×10GbitE with TSN + 2×10GbitE (SERDES) with TSN | 2×25GbE KR + 2×BaseT (up to 10Gb) with TSN | 1×GbE with TSN USB¹ 4×USB 4.0, 4×USB 3.2 ×1 / USB 3.2 ×1 + 8×USB 2.0 | 4×USB 4.0 + 8×USB 2.0 | 4×USB 3.2 or 2×USB 4.0 multiplexed with 2×DDI + 8×USB 2.0 SATA¹ 2×SATA Gen 3 | 2×SATA Gen 3 | 4×SATA Gen 3 CAN bus¹ 1× | – | 2 UART1 2× | 2× | – GPIO¹ 12× | 12× | 8× Other¹ eSPI, 2×SPI, SMB, 2×I2C | SMB, 2×I2C, IPMB | LPC/eSPI ¹ Not all I/Os are available in parallel; some pins are shared. --- Server-class module standards in comparison COM-HPC Server | COM Express Type 7 (Spec 3.1) Dimensions 160mm×160mm (Size D) 200mm×160mm (Size E) | 125mm×95mm (Basic) Connector height (module bottom to carrier board top) 5mm or 10mm | 5mm or 10mm Stack height (carrier board top to heat-spreader top) 20mm or 25mm | 18mm or 23mm Max. power dissipation 358W | 137W Input voltage range 12V | 12V Signal pins 800 | 440 PCIe lanes¹ 65×PCIe Gen 6 | 32×PCIe Gen 4 Graphics¹ Headless | Headless Sound1 – | – Camera in¹ – | – Ethernet1 8×25GbE KR + 1×1GbE with NCSI | 4×10GbE KR + 1× GbE USB¹ 2×USB 4.0 + 2×USB 3.1 + 8×USB 2.0 | 4×USB 3.0 + 4×USB 2.0 SATA¹ 2×SATA Gen 3 | 2×SATA Gen 3 CAN bus¹ – | 2×(multiplexed with UART) UART1 2 | 2 GPIO¹ 12 | 8 Other¹ eSPI, 2×SPI, SMB, 2×I2C | LPC/eSPI, I2C, SPI Platform Management Interface IPMB | NCSI + IPMB ¹ Not all I/Os are available in parallel; some pins are shared. --- COM Express module types in comparison COM Express 3.1 Type 10 (Mini) | COM Express Type 6 (Spec 3.1) | COM Express Type 7 (Spec 3.1) Dimensions 84mm×55mm | 125mm×95mm (Basic) 95mm×95mm (Compact) | 125mm×95mm (Basic) Connector height (module bottom to carrier board top) 5mm or 10mm | 5mm or 10mm | 5mm or 10mm Stack height (carrier board top to heat-spreader top) 18mm or 23mm | 18mm or 23mm | 18mm or 23mm Max. power dissipation 68W | 137W | 137W Input voltage range 12V, optional wide-range input power of 4.75 to 20V | 12V | 12V Signal pins 220 | 440 | 440 PCIe lanes¹ 4×PCIe Gen 4 | 24×PCIe Gen 4 | 32×PCIe Gen 4 Graphics¹ 1×DDI + 1 LVDS/eDP | 3×DDI + 1×LVDS/eDP / VGA | Headless Sound1 1×HDA/SoundWire | HDA (1×SoundWire optional) | – Camera in¹ 2×MIPI CSI via dedicated connectors on the module | 2×MIPI CSI via dedicated connectors on the module | – Ethernet1 1×1GbE with TSN | 1×GbE with TSN | 4×10GbE KR with NCSI + 1× GbE USB¹ 2×USB 3.2 + 8×USB 2.0 | 4×USB 3.2 or 2×USB 4.0 multiplexed with 2×DDI + 8×USB 2.0 | 4×USB 3.0 + 4×USB 2.0 SATA¹ 2×SATA Gen 3 | 4×SATA Gen 3 | 2×SATA Gen 3 CAN bus¹ 2× | 2× | 2×(multiplexed with UART) UART1 2× | – | 2 GPIO¹ 8× | 8× | 8× Other¹ LPC/eSPI | LPC/eSPI | LPC/eSPI, I2C, SPI ¹ Not all I/Os are available in parallel; some pins are shared. --- COM Express module types in comparison (continued view; not repeating the rows in text extraction) --- COM-HPC module types in comparison COM-HPC Mini | COM-HPC Client | COM-HPC Server Dimensions 95mm×70mm | 120mm×95mm (Size A) 120mm×120mm (Size B) 120mm×160mm (Size C) | 160mm×160mm (Size D) 200mm×160mm (Size E) Connector height (module bottom to carrier board top) 5mm or 10mm | 5mm or 10mm | 5mm or 10mm Stack height (carrier board top to heat-spreader top) 15mm or 20mm | 20mm or 25mm | 20mm or 25mm Max. power dissipation 91W | 251W | 358W Input voltage range 8–20V | 12V | 12V Signal pins 400 | 800 | 800 PCIe lanes¹ 16×PCIe Gen 6 | 49×PCIe Gen 6 | 65×PCIe Gen 6 Graphics¹ 3×DDi + 1×eDP | 3×DDI + 1×eDP | Headless Sound1 SoundWire / HDA / I2S | 2×SoundWire / I2S / HDA | – Camera in¹ 2×MIPI CSI via dedicated connectors on the module | 2×MIPI CSI | – Ethernet1 2×10GbitE with TSN + 2×10GbitE (SERDES) with TSN | 2×25GbE KR + 2×BaseT (up to 10Gb) with TSN | 8×25GbE KR + 1×1GbE with NCSI USB¹ 4×USB 4.0, 4×USB 3.2 ×1 / USB 3.2 ×1 + 8×USB 2.0 | 4×USB 4.0 + 8×USB 2.0 | 2×USB 4.0 + 2×USB 3.1 + 8×USB 2.0 SATA¹ 2×SATA Gen 3 | 2×SATA Gen 3 | 2×SATA Gen 3 CAN bus¹ 1× | – | – UART1 2× | 2× | 2× GPIO¹ 12× | 12× | 12× Other¹ eSPI, 2×SPI, SMB, 2×I2C | SMB, 2×I2C, IPMB | eSPI, 2×SPI, SMB, 2×I2C, IPMB ¹ Not all I/Os are available in parallel; some pins are shared. --- COM-HPC ecosystem SMARC Module ecosystem COM Express ecosystem Qseven ecosystem Cooling solutions aReady. Learn more --- congatec China Technology Ltd. Sunyoung Center, 901 Building B, No. 28 Xuanhua Road, Changning District, Shanghai 200050, China Phone: +86 (21) 6025-5862 sales-asia@congatec.com www.congatec.cn congatec Australia Pty Ltd. 3/25 Randall Street, Slacks Creek, Queensland 4127, Australia Phone: +61 (7) 5520-0841 sales-au@congatec.com www.congatec.com congatec Japan K.K. Hamamatsucho 1-Chome building 301, Minato-ku Hamamatsucho 1-2-7, 105-0013 Tokyo-to, Japan Phone: +81 (3) 6435-9250 sales-jp@congatec.com www.congatec.jp congatec, Inc. 6262 Ferris Square San Diego CA 92121 USA Phone: +1 (858) 457-2600 sales-us@congatec.com www.congatec.us congatec Asia Ltd. 2F., No.186, Sec. 3, Chengde Rd. 10366 Taipei, Taiwan Phone: +886 (2) 2597-8577 sales-asia@congatec.com www.congatec.tw Headquarter About congatec congatec GmbH Auwiesenstraße 5 94469 Deggendorf Germany Phone: +49 (991) 2700-0 info@congatec.com www.congatec.com congatec is a leading global provider of high-performance hardware and software building blocks for embedded and edge computing solutions based on Computer-on-Modules (COMs). These advanced computer modules drive systems and devices across industries such as industrial automation, medical technology, robotics, telecommunications, and more. congatec's high-performance aReady. ecosystems simplify and accelerate the solution development, from COM to cloud. This application-ready approach combines COMs with services and customizable technologies that enable cutting-edge advancements in system consolidation, IoT, security, and artifi cial intelligence. Supported by its majority shareholder, DBAG Fund VIII – a German mid-market fund focused on driving growth for industrial enterprises – congatec has the fi nancial backing and M&A expertise to capitalize on expanding market opportunities. congatec Korea Ltd. Leaders building #707, 42 Jangmi-ro, Bundan-gu, Seongnam-si, Gyeonggi-do, 13496 South Korea Phone: +82 (10) 2715-6418 ckr-sales@congatec.com www.congatec.kr conga and congatec are registered trademarks of congatec GmbH. Intel, Pentium, Xeon, and Atom are trademarks of Intel Corporation in the U.S. and other countries. SMARC, Qseven, and SGET are registered trademarks of SGET e.V. AMD is a trademark of Advanced Micro Devices, Inc. COM Express and COM-HPC are registered trademarks of PICMG. PCI Express is a registered trademark of the Peripheral Component Interconnect Special Interest Group (PCISIG). Winbond is a registered trademark of the Winbond Electronics corps. AMICORE8 is a registered trademark of American Megatrends inc. Microsoft, Windows, Windows NT, Windows CE, and Windows XP® are registered trademarks of Microsoft corporation. VxWorks is a registered trademark of WindRiver. AMD and Fusion are registered trademarks of AMD. I.MX and NXP are registered trademarks of NXP, Inc. All product names and logos are property of the respective manufacturers. All data is for information purposes only. Although all the information contained within this document is carefully checked no guarantee of correctness is implied or expressed. Subsidiaries Let’s connect © 2025 congatec GmbH. All rights reserved.