COM-HPC

COM-HPC Modules: Next-Generation High-Performance Computer-on-Module

 

COM-HPC (Computer-on-Module High Performance Computing) is a PICMG open standard launched in 2021, purpose-built to address the bandwidth and compute limitations of COM Express in modern high-performance embedded applications.

 

It introduces a new high-density connector with significantly more signal lanes than COM Express, enabling interfaces that simply weren’t possible under the older standard (including PCIe Gen 5, USB4 (up to 40 Gbps), and 25 Gigabit Ethernet).

Like COM Express, COM-HPC separates the compute module from the carrier board, protecting your hardware investment across processor generations.

 

Find the Right COM-HPC Module for Your Application

COM-HPC is divided into three module categories, each defined by the PICMG specification:

 

COM-HPC Mini (95 × 70 mm)
The newest and smallest addition to the COM-HPC family, introduced to bring next-generation interfaces (PCIe Gen 4/5, USB4) to ultra-compact designs. It uses a single connector with 400 pins and supports low-power processors typically up to ~28 W TDP.

 

It’s effectively the modern successor to COM Express Mini / Type 10. COM-HPC mini is best suited for space-constrained, fanless, and mobile designs that need modern high-speed I/O such as portable medical devices, smart cameras, drones and battery-powered industrial equipment.

 

COM-HPC Client (Sizes A, B, C)
The mainstream embedded category, covering sizes from 120 × 95 mm (Size A) up to 160 × 120 mm (Size C). Client modules support rich graphics, multiple displays, USB4, and PCIe Gen 5 with processors like Intel Core Ultra and AMD Ryzen Embedded, typically 15–65 W TDP. This is the natural successor to COM Express Type 6.

 

COM-HPC Client is best suited for high-performance embedded systems with display and graphics requirements, for example machine vision, medical imaging, industrial HMI, edge AI inference and defence systems.

 

COM-HPC Server (Sizes D, E)
The largest category, up to 200 × 160 mm, designed for headless, server-class edge computing. Server modules support high core-count processors, large ECC memory capacities up to 1 TB, and massive I/O bandwidth including multiple 25GbE interfaces. The successor to COM Express Type 7.

 

It is a great choise for edge servers and embedded HPC where data-centre-class compute is needed in harsh or remote environments, such as 5G/telecom edge infrastructure, radar and signal processing, autonomous vehicles and defence platforms.