Thermal Interface Material
With thermal conductivity up to 10 W/mK, Thermal Interface Materials (TIM) optimize heat transfer across industries.
TIMs are placed between a heatsink and a device to improve thermal conductivity by eliminating air gaps, which hinder heat dissipation. Since even smooth surfaces have microscopic voids, TIMs fill these gaps, enhancing efficiency. Various TIM types serve different applications, ensuring optimal performance.
We provide customized TIM solutions, including die-cast parts, tailored to your needs. Our expertise in thermal management, innovation, and quality makes us a trusted partner for OEMs in vehicle, defense, and industrial automation sectors.
Double-Sided Tapes (DST)
Double-Sided Tapes (DST) are a common material generally used on small heatsinks. They vary in thickness and can be used to fill voids between the device and the heatsink.
The DST also has mechanical strength to hold the heatsink in place. Some DST materials are better suited for plastic devices vs. metal, so make sure the final use is well understood.
Gap Filler Pads
Enhance the efficiency of your thermal management systems with our gap filler pads.
Ideal for bridging the gap between heat sources and heat sinks, these pads significantly improve thermal transfer, ensuring optimal performance in a variety of applications.
Address silicone contamination concerns with our non-silicone gap fillers. They provide the thermal performance of silicone-based fillers without the risk of outgassing, making them ideal for sensitive applications