
As power electronics, electrification, and high-performance computing continue to evolve, thermal management has become one of the most critical choices to make in the design phase. When systems exceed +1 kW power usage, conventional cooling methods are often no longer sufficient.
In these environments, high power cooling solutions must ensure stable junction temperatures, uniform heat distribution, and long-term reliability under demanding operating conditions.
Once power dissipation crosses the 1 kW threshold, several thermal challenges increase significantly:
Components such as IGBTs, IGCTs, diodes, processors, EV batteries, battery charging equipment, and telecom base stations generate concentrated thermal loads. Without properly engineered high power cooling, system reliability and lifetime are compromised. For many modern systems, thermal management defines overall performance.
Air-cooled skived heat sinks can be effective where airflow is controlled and power density is moderate.
For higher heat flux and compact systems, liquid cooled plates provide significantly better thermal performance.
In extreme high-current environments, specialized water coolers ensure uniform temperature distribution across stacked semiconductor devices.
Early thermal simulation and mechanical integration planning are critical to ensure that the selected cooling solution supports long-term performance.
Choosing the optimal high power cooling solution depends on:
Choosing the optimal high power cooling solution depends on:
Total power dissipation
Environmental conditions
Space limitations
Reliability targets
Maintenance accessibility
In certain applications, air cooling is still a viable solution above 1 kW but only with highly optimized heat sink designs. FlexFin skiving is a precision manufacturing process where fins are cut directly from a solid aluminum block. Because the fins and base are a single piece of material, thermal conductivity remains highly efficient from the heat source into the fins.
This method enables:
Skived heat sinks are particularly suitable for compact power electronics, LED systems, and telecom applications where forced airflow is available. However, as power density increases further or airflow becomes limited, liquid-based high power cooling solutions become necessary.

For systems operating at 1 kW and beyond, liquid cooled plates, also known as cold plates are among the most efficient cooling solutions available.
Instead of relying on air, these systems use liquids such as water, glycol, or water-glycol mixtures. The fluid circulates through tubes or internal channels embedded in a metal base plate, absorbing heat directly from mounted components.
Because liquid has significantly higher thermal capacity than air, cold plates enable:
For many industrial engineers, liquid cooling is the preferred architecture for reliable high power cooling.

We offer liquid cooling plates in two different versions, with exposed or fully buried tubes, each of them having their own benefits.Â
In full buried cold plate designs, cooling tubes are integrated within the base material, enabling double-sided cooling and optimized thermal contact.
Typically manufactured in aluminum or copper, these systems use thermally conductive epoxy to bond the tubes to the base. The internal flow path is designed according to the location of heat sources, ensuring efficient heat extraction.
They offer excellent temperature uniformity and are suitable for applications with concentrated heat loads.
Exposed tube cold plates use a similar principle but provide single-sided cooling. The cooling tubes are mounted to the surface of the base plate with thermal epoxy.
Although slightly less optimized than fully buried designs, they remain highly effective for high power cooling in many industrial systems. They are often selected when design flexibility and cost optimization are priorities.
Do you have questions about our solutions or want to discuss a project? We're happy to help. Don't hesitate to reach out – we look forward to hearing from you.
