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COM-HPC Mini Ecosystem Upcoming high-performance standard in a nearly credit-card sized form factor

congatec COM-HPC Mini Modules

Upcoming high-performance standard in a nearly credit-card sized form factor

 

Main Features

  • Credit-card size form factor
  • High-performance CPU+GPU
  • Extensive connectivity with PCIe Gen 5, USB4, MIPI CSI, etc.

Description

congatec's upcoming COM-HPC Mini ecosystem offers extraordinary performance and I/O density for space- and power-restricted applications.

Target use cases can be found in all next-generation high-end embedded systems, including embedded vision for which it also offers two MIPI-CSI interfaces.

 

COM-HPC Mini has been developed with the aim of delivering the smallest high-performance standardized module currently possible. It follows the highly successful COM HPC Client and Server standards that are specifically designed to deliver extreme computing performance and interface bandwidth to demanding edge applications. COM-HPC Mini brings these features to Small Form Factor (SFF) designs. It is positioned on top of comparable SFF standards, such as COM Express Mini, and provides future oriented applications that face space constraints and power limitations with an unprecedented level of IO and computing power.

 

 

Downloads

congatec conga-HPC/mPTL Datasheet

congatec conga-HPC/mPTL Datasheet

COM-HPC Mini Module based on Intel® Core™ Ultra Processors Series 3 (Panther Lake-H)

congatec conga-HPC/mIQ-X Datasheet

congatec conga-HPC/mIQ-X Datasheet

First high performance ARM on COM-HPC Mini based on Qualcomm® Dragonwing™ IQ-X Series

congatec conga-HPC/mRLP Datasheet

congatec conga-HPC/mRLP Datasheet

COM-HPC Mini Size high performance module based on 13th Gen Intel® Core™ processor series (code name "Raptor Lake-P")

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Manufacturers

Manufacturer
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