
Honeywell ABP3 pressure sensors deliver accurate, temperature-compensated pressure measurement with analog or digital outputs and liquid-media options.
Honeywell ABP3 pressure sensors provide high-accuracy, temperature-compensated pressure measurement for medical, industrial and commercial applications. These compact, board-mounted sensors combine flexible pressure ranges, analog and digital outputs, and options for liquid-media compatibility. As a result, engineers can integrate precise pressure sensing into a wide range of electronic systems.
The ABP3 Series builds on Honeywell's established ABP and ABP2 sensor families. It offers enhanced measurement performance, advanced diagnostics and a broad selection of mechanical configurations.
The Honeywell ABP3 Series supports pressure ranges from 2.5 mbar to 10 bar, depending on the selected model. Absolute, differential and gage pressure configurations allow engineers to match the sensor to specific measurement requirements.
Selected configurations achieve a Total Error Band (TEB) as low as ±1.5% of Full Scale Span (FSS) between 0°C and 50°C. The actual TEB depends on pressure range, media protection and temperature.
Unlike a basic accuracy specification, TEB accounts for several sources of measurement error. These include non-linearity, hysteresis, repeatability and temperature-related effects. Consequently, it provides a useful basis for evaluating sensor performance in real operating conditions.
The sensors operate and are temperature-compensated from -40°C to +110°C, supporting applications exposed to changing environmental temperatures.
The ABP3 Series offers analog voltage outputs and digital interfaces using I²C or SPI communication.
Digital versions provide up to 15-bit effective resolution, while standard configurations support measurement update rates up to 4,000 samples per second.
In addition, digital models feature temperature output and advanced diagnostics. These functions help system designers monitor measurement conditions and integrate pressure sensing into electronic control systems.
Available supply voltage configurations support integration with different circuit designs. Furthermore, the compact sensor footprint helps minimize PCB space requirements.
Honeywell offers the ABP3 Series with different media protection options.
Dry-gas configurations serve pneumatic and air-pressure applications. Meanwhile, liquid-compatible versions use silicone or fluorosilicone gel to protect sensitive components from appropriate measurement media.
Selected configurations also support wet-on-wet differential pressure measurement, enabling liquid pressure measurements on both ports.
Engineers can choose between DIP, SMT and leadless SMT packages. Several pressure port designs are available, including axial, radial and dual-port configurations.
This mechanical flexibility simplifies integration into different PCB layouts and pressure connections.
The Honeywell ABP3 pressure sensors are suitable for a broad range of pressure measurement applications.
Potential applications include ventilators, oxygen concentrators, CPAP devices, patient monitoring equipment and spirometry systems.
In these systems, accurate pressure measurements support the monitoring and regulation of air or fluid pressure.
Industrial applications include pneumatic control, air filtration, clogged-filter detection, HVAC equipment, pumps and gas analysis systems.
Differential pressure models can monitor pressure differences across filters or other components. This supports condition monitoring and process control.
The ABP3 Series can also be integrated into smart water and gas meters, liquid-level measurement systems, household appliances and other compact electronic devices.
EG Electronics supports Nordic customers in selecting and integrating electronic components for demanding applications.
The Honeywell ABP3 Series offers a flexible solution for engineers developing equipment that requires compact, accurate and temperature-compensated pressure sensing.
Contact EG Electronics to discuss pressure ranges, output interfaces, media compatibility and mechanical configurations for your application.
| Specification | Value |
| Manufacturer | Honeywell Technologies |
| Series | ABP3 Series |
| Product category | High accuracy, compensated/amplified board mount pressure sensor |
| Sensing technology | Piezoresistive |
| Pressure types | Absolute; differential; gage (variant-dependent) |
| Series pressure range | 2.5 mbar to 10 bar; 1 inH2O to 150 psi (depending on pressure type and model) |
| Output options | Analog; digital I²C; digital SPI |
| Digital output format | 16-bit |
| Digital effective resolution | 14 bits typical; 15 bits maximum |
| Analog resolution | 0.03 % FSS minimum (datasheet Table 2) |
| Analog supply voltage (3.3 V version) | 3.0 to 3.6 Vdc; 3.3 Vdc typical |
| Analog supply voltage (5 V version) | 3.0 to 5.5 Vdc; 5.0 Vdc typical |
| Digital supply voltage | 2.7 to 5.5 Vdc; 3.3 Vdc typical |
| Analog power consumption at 3.3 V | 15.18 mW typical; 18.15 mW maximum (Table 2) |
| Analog power consumption at 5 V | 23 mW typical; 27.5 mW maximum (Table 2) |
| Digital power consumption at 5 V | 9.9 mW typical (Table 2) |
| Digital sleep/standby current | 10 µA typical; 20 µA maximum (Table 2) |
| Operating temperature | -40°C to 110°C |
| Compensated temperature | -40°C to 110°C |
| Start-up time | 5 ms maximum; first digital measurement command after 2.5 ms |
| Default update rate | 1000 samples/s |
| Standard update rate maximum | 4000 samples/s (Table 2); higher rates by consultation with manufacturer |
| Accuracy for 0 to 16 mbar models | ±0.4 % FSS BFSL maximum |
| Accuracy for 16 mbar to 10 bar models | ±0.25 % FSS BFSL maximum |
| Total Error Band (TEB) | Variant/range/temperature-dependent; as low as ±1.5 % FSS at 0°C to 50°C for selected D/V models |
| Digital temperature output error | ±5°C typical |
| Analog transfer function | 10 % to 90 % of Vsupply (A) |
| Digital transfer function | 10 % to 90 % of 2^16 counts (A); signed 16-bit interpretation |
| Analog clipping limits | 5 % to 95 % of Vsupply |
| I²C addresses | 0x08; 0x18; 0x28; 0x38; 0x48; 0x58; 0x68; 0x78 (model-dependent) |
| I²C clock frequency | 100 to 400 kHz (absolute maximum specifications table) |
| SPI clock frequency | 10 MHz maximum (absolute maximum specifications table) |
| SPI/I²C digital input low | 20 % Vsupply maximum |
| SPI/I²C digital input high | 80 % Vsupply minimum |
| SDA/SCL pull-up | 1 kΩ minimum (Table 2) |
| Digital supply absolute maximum | -0.3 to 6.0 Vdc |
| Analog supply absolute maximum | -0.3 to 6.0 Vdc |
| Voltage on any pin absolute maximum | -0.3 Vdc to Vsupply + 0.3 Vdc |
| ESD susceptibility, human body model | ±2 kV |
| Storage temperature | -40°C to 125°C |
| Relative humidity, external surfaces | 0 %RH to 95 %RH, non-condensing |
| Relative humidity, internal, liquid options V/F | 0 %RH to 100 %RH, condensing |
| Relative humidity, internal, dry-gas option D | 0 %RH to 95 %RH, non-condensing |
| Vibration | 15 g, 10 Hz to 2 kHz |
| Shock | 75 g, 6 ms |
| Life | 1 million full-scale pressure cycles minimum; application-dependent |
| Moisture sensitivity | IPC/JEDEC J-STD-020E MSL 2 |
| Shelf life | Unlimited inside sealed moisture barrier bag |
| Floor life | 1 year after removal from sealed moisture barrier bag at <30°C and <60 %RH |
| Lead soldering (DIP) | 4 s maximum at 250°C |
| Peak reflow soldering (SMT/leadless SMT) | 15 s maximum at 250°C |
| Compliance | REACH and RoHS compliant (manufacturer stated) |
| Food-contact material certification | BPA Free and LFGB, silicone gel coating on Port 1 only |
| Pressure port 1 wetted materials, dry gas | High-temperature polyamide/304 SST ports and covers; FR4 substrate; epoxy/silicone adhesives; silicon/glass/gold/aluminum electronics |
| Pressure port 1 wetted materials, liquid | High-temperature polyamide/304 SST ports and covers; epoxy/silicone gel/fluorosilicone gel adhesives |
| Pressure port 2 wetted materials | High-temperature polyamide; FR4; epoxy/silicone; silicon |
| Port configurations | No port; single axial barbed; single axial barbless; single axial straight; single radial barbed; dual radial barbed; dual axial barbed (package-dependent) |
| Packaging | DIP; SMT; leadless SMT |
| Digital diagnostics | Advanced diagnostics enabled by default |
| Digital temperature output | Enabled by default |
| I²C pins 1–6 | GND; VDD; EOC; NC; SDA; SCL |
| SPI pins 1–6 | GND; VDD; MOSI; SS; MISO; SCLK |
| Analog pins 1–6 | GND; NC; VOUT; NC; NC; VDD |
| Bypass capacitor recommendation | 0.1 µF close to sensor supply pin |
| Sensor width, typical body drawing | 8.2 mm (package/port-dependent drawings) |