Schlegel TCR 200 Thermal Gap Filler

Schlegel Thermal Gap Fillers

Thermal Gap Pads are most commonly used to bridge components to a heat sink or chassis. Schlegel offers a wide range of Gap Pads with nearly 50 different versions with thermal conductivity ranging from 1 to 14 W/mK

 

Typical Applications Include:
• Mass storage devices
• Telecommunications hardware
• Notebook computers
• Power supplies