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Schlegel OP-8300 Thermal Gap Filler

Very good good conformability.

Description

Schlegel Thermal Gap Fillers

Thermal Gap Pads are most commonly used to bridge components to a heat sink or chassis. Schlegel offers a wide range of Gap Pads with nearly 50 different versions with thermal conductivity ranging from 1 to 14 W/mK

 

Typical Applications
• Notebook and desktop computers
• Memory modules
• Heat pipe assemblies
• HDDs and DVDs
• Flat-panel displays
• Telecommunication hardware

 

OP-8300 Series is available in 7 different versions. They are ceramic filled silicone elastomer. The 8300 series is exceptionally soft (hardness shore 00 from 5-25) and is suitable for applications that require moderate thermal performance. 
OP-8300 series is electrically non-conductive and naturally tacky. Additional adhesive is generally not required

 

The proprietary formulation of OP-8300 series is RoHS compliant  and halogen-free, providing extra reassurance in applications where  hazardous substances are forbidden

 

Technical Specifications Thermal Gap Filler - OP8300 series

 
 
Product Color Thickness Range [inch/(mm)] Thermal Conductivity [W/mK] Hardness [Shore 00] Operation Temperature [°C] Halogen-Free [under 700ppm]
OP-8300 Spec 06 SE Blue 0.02″ (0.50) ~ 0.40″ (10.1) 1,5 5 -40°C~200°C Yes
OP-8300 Blue 0.01″ (0.25)~0.40″ (10.1) 1,5 25 -40°C~200°C Yes
OP-8300 Spec 02 Sky Blue 0.01″ (0.25)~0.40″ (10.1) 1,5 20 -40°C~200°C Yes
OP-8300 Spec 03 Sky Blue 0.01″ (0.25)~0.40″ (10.1) 1,8 20 -40°C~200°C Yes
OP-8300 Spec 05 Blue 0.01″ (0.25)~0.40″ (10.1) 1 10 -40°C~200°C Yes
OP-8300 Spec 06 Blue 0.02″ (0.50)~0.40″ (10.1) 1,5 10 -40°C~200°C Yes
OP-8300 Spec 07 Blue 0.02″ (0.50)~0.40″ (10.1) 1,2 15 -40°C~200°C Yes
 

Downloads

OP-8300 Data sheet

OP-8300 Spec 02 Data sheet

OP-8300 Spec 03 Data sheet

OP-8300 Spec 05 Data sheet

OP-8300 Spec 06-SE Data sheet

OP-8300 Spec 06 Data sheet

OP-8300 Spec 07 Data sheet

Manufacturers

Manufacturer
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