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Schlegel OP-8400 Thermal Gap Filler

Available in eight different versions, all offering excellent thermal performance across a range of hardness levels.

Description

Schlegel Thermal Gap Fillers

Thermal Gap Pads are most commonly used to bridge components to a heat sink or chassis. Schlegel offers a wide range of Gap Pads with nearly 50 different versions with thermal conductivity ranging from 1 to 14 W/mK

 

Typical Applications
• Notebook and desktop computers
• Memory modules
• Heat pipe assemblies
• HDDs and DVDs
• Flat-panel displays
• Telecommunication hardware

 

OP-8400 Series Overview

The OP-8400 Series is available in eight different versions, all offering excellent thermal performance across a range of hardness levels.

  • OP-8400 Spec 10 features high tensile strength, making it suitable for applications requiring durability and structural integrity.

  • OP-8400 Spec 09 is an ideal thermal interface material (TIM) designed to replace messy thermal grease compounds, offering clean and efficient heat transfer.

 

The proprietary formulation of OP-8400 series is RoHS compliant  and halogen-free, providing extra reassurance in applications where  hazardous substances are forbidden

 

Technical Specifications Thermal Gap Filler - OP8400 series

 
 
 

Downloads

OP-8400 Data sheet

OP-8400 Spec 01 Data sheet

OP-8400 Spec 05 Data sheet

OP-8400 Spec 06 Data sheet

OP-8400 Spec 07 Data sheet

OP-8400 Spec 08 Data sheet

OP-8400 Spec 09 Data sheet

OP-8400 Spec 10 Data sheet

Manufacturers

Manufacturer
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