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Schlegel OP-8500 Thermal Gap Filler

Available in 15 different versions, all offering excellent thermal performance across a range of hardness levels.

Description

Schlegel Thermal Gap Fillers

Thermal Gap Pads are most commonly used to bridge components to a heat sink or chassis. Schlegel offers a wide range of Gap Pads with nearly 50 different versions with thermal conductivity ranging from 1 to 14 W/mK

 

Typical Applications
• Cooling component to the chassis,
frame, or other type of heat spreader
• Mass storage devise
• Heat pipe assemblies
• RDRAM memory modules
• Motor control
• Telecommunication hardware

 

OP-8500 Series Overview

The OP-8500 Series is available in 15 different versions, all offering good thermal performance across a range of hardness levels.

  • OP-8500 Spec 10 offers excellent thermal performance and excellent conformability under low pressure. It is electrically insulating and naturally tacky, usually requiring no additional adhesive.

  • OP-8500 Spec 05 SE delivers strong thermal performance and excellent conformability under low pressure. It’s electrically insulating and naturally tacky, typically without the need for added adhesive.

The proprietary formulation of OP-8500 series is RoHS compliant  and halogen-free, providing extra reassurance in applications where  hazardous substances are forbidden

 

Technical Specifications Thermal Gap Filler - OP8500 series

 

Downloads

OP-8500 Data sheet

OP-8500 Spec 01 Data sheet

OP-8500 Spec 01-SE Data sheet

OP-8500 Spec 02 Data sheet

OP-8500 Spec 03 Data sheet

OP-8500 Spec 04 Data sheet

OP-8500 Spec 05 Data sheet

OP-8500 Spec 05-SE Data sheet

OP-8500 Spec 06 Data sheet

OP-8500 Spec 07 Data sheet

Manufacturers

Manufacturer
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