High performance thermal gap filler with good conformability
Description
Schlegel Thermal Gap Fillers
Thermal Gap Pads are most commonly used to bridge components to a heat sink or chassis. Schlegel offers a wide range of Gap Pads with nearly 50 different versions with thermal conductivity ranging from 1 to 14 W/mK
Typical Applications
• Cooling component to the chassis,
frame, or other type of heat spreader
• Mass storage device
• Heat pipe assemblies
• RDRAM memory modules
• Motor control
• Telecommunication hardware
OP-8600 High-Performance Thermal Gap Filler
OP-8600 is a high-performance thermal gap filler engineered for excellent conformability and efficient thermal management. It effectively blankets uneven surfaces, ensuring optimal heat transfer from the heat source to the cooling component.
This material is electrically non-conductive and naturally tacky, eliminating the need for additional adhesives in most applications. Its RoHS compliance and halogen-free formulation make OP-8600 a reliable choice for applications where environmental and safety standards are a priority.
Technical Specifications Thermal Gap Filler - OP8600