Schlegel OP-8800 Thermal Gap Filler

Thermal Gap Pads are most commonly used to bridge components to a heat sink or chassis. Schlegel offers a wide range of Gap Pads with nearly 50 different versions with thermal conductivity ranging from 1 to 14 W/mK.

Typical Applications
• Cooling component to the chassis,
frame, or other type of heat spreader
• Mass storage device
• Heat pipe assemblies
• RDRAM memory modules
• Motor control
• Telecommunication hardware

OP-8600 Thermal Gap Filler

OP-8600 is a high-performance thermal gap filler known for its excellent conformability. It effectively blankets uneven surfaces, facilitating efficient heat transfer from the heat source to the cooling component.

Naturally tacky and electrically non-conductive, OP-8600 typically requires no additional adhesive. Its RoHS compliance and halogen-free composition make it a safe and dependable choice for applications sensitive to hazardous substances.