Schlegel OP-9400 Spec 01 Thermal Gap Filler

Thermal Gap Pads are most commonly used to bridge components to a heat sink or chassis. Schlegel offers a wide range of Gap Pads with nearly 50 different versions with thermal conductivity ranging from 1 to 14 W/mK.

Typical Applications
• Cooling component to the chassis,
frame, or other type of heat spreader
• Mass storage device
• Heat pipe assemblies
• RDRAM memory modules
• Motor control
• Telecommunication hardware

OP-9400 Spec01 – Thermally Conductive Gap Filler

OP-9400 Spec01 features a proprietary metal filler formula that delivers superior thermal performance while maintaining moderate compressibility.

This RoHS and halogen-free compliant gap filler is ideal for applications requiring high thermal conductivity along with strict environmental safety standards.

Naturally tacky by design, OP-9400 Spec01 typically does not require additional adhesives, simplifying assembly and ensuring reliable surface contact.