EG Electronics | Schlegel OP-9700 Thermal Gap Filler

Description

Schlegel Thermal Gap Fillers

Thermal Gap Pads are most commonly used to bridge components to a heat sink or chassis. Schlegel offers a wide range of Gap Pads with nearly 50 different versions with thermal conductivity ranging from 1 to 14 W/mK.

Typical Applications
• Cooling component to the chassis,
frame, or other type of heat spreader
• Mass storage device
• Heat pipe assemblies
• RDRAM memory modules
• Motor control
• Telecommunication hardware

OP-9700 – Thermally Conductive Gap Filler

OP-9700 features a proprietary metal filler formulation that delivers exceptional thermal performance with moderate compressibility, making it well-suited for a range of demanding thermal management applications.

Fully RoHS and halogen-free compliant, OP-9700 supports designs that require both high thermal conductivity and strict adherence to environmental and safety standards.

The material is naturally tacky, enabling effective placement without the need for additional adhesives in most applications.

Product	Color	Thickness Range [inch/(mm)]	Thermal Conductivity [W/mK]	Hardness [Shore 00]	Operation Temperature [°C]	Halogen-Free [under 700ppm]
OP-9700	Grey	0.03″ (0.76)~0.40″ (10.1)	10	60	-40°C~200°C	Yes

Schlegel OP-9700 Thermal Gap Filler

Description

Technical Specifications Thermal Gap Filler - OP9700

Downloads

OP-9700 Data sheet

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Hans Linde

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