Gap filling materials suitable for cost sensitive applications
Main Features
Description
Schlegel Thermal Gap Fillers
Thermal Gap Pads are most commonly used to bridge components to a heat sink or chassis.
Schlegel offers a wide range of Gap Pads with nearly 50 different versions with thermal conductivity ranging from 1 to 14 W/mK
Typical Applications Include:
• Mass storage devices
• Telecommunications hardware
• Notebook computers
• Power supplies
OP-8100 Series is available in 4 versions. It is gap filling materials suitable for cost sensitive applications. It is electrically non-conductive and offers moderate thermal conductivity and compressibility.
The proprietary formulation of OP-8100 is RoHS compliant and halogen-free, providing extra reassurance in applications where hazardous substances are forbidden.
Technical Specifications Thermal Gap Filler - OP8100 series
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