EG Electronics | Schlegel OP-8200 Thermal Gap Filler

Description

Schlegel Thermal Gap Fillers

Thermal Gap Pads are most commonly used to bridge components to a heat sink or chassis. Schlegel offers a wide range of Gap Pads with nearly 50 different versions with thermal conductivity ranging from 1 to 14 W/mK

Typical Applications Include:
• Mass storage devices
• Telecommunications hardware
• Notebook computers
• Power supplies

OP-8200 Series is available in 6 different versions. These materials offers from good to superb thermal performance and very good conformability. These materials conforms to surface irregularities under low application pressures. They are electrically non-conductive and naturally tacky. Additional adhesive is generally not required.

The proprietary formulation of OP-8200 series is RoHS compliant and halogen-free, providing extra reassurance in applications where hazardous substances are forbidden

Technical Specifications Thermal Gap Filler - OP8200 series

Product	Color	Thickness Range [inch/(mm)]	Thermal Conductivity [W/mK]	Hardness [Shore 00]	Operation Temperature [°C]	Halogen-Free [under 700ppm]
OP-8200	Light Grey	0.01″ (0.25)~0.40″ (10.1)	1,5	60	-40°C~200°C	Yes
OP-8200 Spec 03	Light Grey	0.01″ (0.25)~0.40″ (10.1)	1,5	40	-40°C~200°C	Yes
OP-8200 Spec 05	Grey	0.02″ (0.50)~0.20″ (5.08)	12	60	-40°C~200°C	Yes
OP-8200 Spec 06	Grey	0.03″ (0.76)~0.20″ (5.08)	14	60	-40°C~200°C	Yes
OP-8200 Spec 07	Grey	0.03″ (0.76)~0.40″ (10.1)	10,5	60	-40°C~200°C	Yes
OP-8200 Spec 08	Grey	0.03″ (0.76)~0.40″ (10.1)	10	60	-40°C~200°C	Yes

Schlegel OP-8200 Thermal Gap Filler

Description

Technical Specifications Thermal Gap Filler - OP8200 series

Downloads

OP-8200

OP-8200 Spec 03

OP-8200 Spec 05

OP-8200 Spec 07

OP-8200 Spec 08

OP-8200 Spec 06

Schlegel OP8200 Spec 10 Thermal Gap Filler Datasheet

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Hans Linde

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