From good to superb thermal performance and very good conformability.
Description
Schlegel Thermal Gap Fillers
Thermal Gap Pads are most commonly used to bridge components to a heat sink or chassis. Schlegel offers a wide range of Gap Pads with nearly 50 different versions with thermal conductivity ranging from 1 to 14 W/mK
Typical Applications Include:
• Mass storage devices
• Telecommunications hardware
• Notebook computers
• Power supplies
OP-8200 Series is available in 6 different versions. These materials offers from good to superb thermal performance and very good conformability. These materials conforms to surface irregularities under low application pressures. They are electrically non-conductive and naturally tacky. Additional adhesive is generally not required.
The proprietary formulation of OP-8200 series is RoHS compliant and halogen-free, providing extra reassurance in applications where hazardous substances are forbidden
Technical Specifications Thermal Gap Filler - OP8200 series
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