Edge and cloud applications are increasingly requiring more computing power. Smaller machines, where space is limited, often need customized interfaces. To enhance efficiency and optimize investments, it's essential to combine standardized computers and modules with a custom carrier board featuring specialized electronics and mechanics.
To facilitate this we provide a variety of embedded modules for industrial applications, including OSM, SMARC™, COM Express and COM-HPC, all of which offer full flexibility and scalability.
COM Express modules are easily exchangeable and flexible, making it easier for customers to design them into embedded devices of different sizes. This reduces time to market and increases competitiveness.
COM-HPC is the COM standard for high performance computing.
The OSM standard offers several advantages, including manufacturer independence, easy and affordable embedded application development, and shortened time-to-market due to its low design risk. For cost-sensitive embedded applications and high computing performance, we offer OSM boards that combine a microprocessor, flash, RAM, and a power supply on a compact printed circuit board.
We provide QSeven modules from Kontron and Arbor. Kontron's low-power embedded architecture platform for Computer-on-Modules are based on ARM and X86 technology. Arbor's Qseven compact COM module is designed for efficiency and performance. It features Intel Atom processors and Celeron in an ultra-small form factor, with a compact size of 70 x 70 mm. The Qseven computer on module stands out with its remarkably compact size, making it one of the smallest COM standards available today.
SMARC boards are low-power embedded architecture platforms for Computer-on-Modules based on ARM and X86 technology. They support the development of mobile, embedded, and connected solutions. Designed as scalable building blocks, these systems are ultra-low-power and low-profile and can withstand harsh industrial environments.